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Machine translation
1. (WO2014199981) INSULATED COVERED WIRE AND MULTI-WIRE WIRING BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2014/199981    International Application No.:    PCT/JP2014/065338
Publication Date: 18.12.2014 International Filing Date: 10.06.2014
IPC:
H01B 7/02 (2006.01), H01B 3/30 (2006.01), H01B 3/44 (2006.01), H05K 3/10 (2006.01), H05K 3/46 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606 (JP)
Inventors: YAMAGUCHI Hiroyuki; (JP).
OGINO Haruo; (JP).
KURIHARA Seiichi; (JP)
Agent: MINAKAWA Kazuyasu; c/o HITACHI CHEMICAL COMPANY., LTD., 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606 (JP)
Priority Data:
2013-122664 11.06.2013 JP
Title (EN) INSULATED COVERED WIRE AND MULTI-WIRE WIRING BOARD
(FR) FIL RECOUVERT ISOLÉ ET CARTE DE CÂBLAGE À FILS MULTIPLES
(JA) 絶縁被覆ワイヤ及びマルチワイヤ配線板
Abstract: front page image
(EN)An insulated covered wire which is provided with a wire, a wire covering layer that is arranged around the wire, and a wire adhesive layer that is arranged around the wire covering layer, said wire covering layer being formed of a fluorine-based resin, a polyamide imide resin, a low dielectric constant polyimide resin having a relative dielectric constant of less than 3.6 at 10 GHz or a combination of two or more of these resins; and a multi-wire wiring board which uses this insulated covered wire.
(FR)L'invention concerne un fil recouvert isolé qui comprend un fil, une couche de couverture de fil qui est agencée autour du fil, et une couche adhésive de fil qui est agencée autour de la couche de couverture de fil, ladite couche de couverture de fil étant formée d'une résine à base de fluor, d'une résine polyamide-imide, d'une résine polyimide à faible constante diélectrique ayant une constante diélectrique relative inférieure à 3,6 à 10 GHz ou d'une combinaison d'au moins deux de ces résines ou plus ; une carte de câblage à fils multiples qui utilise ce fil recouvert isolé.
(JA) ワイヤと、このワイヤの周囲に配置したワイヤ被覆層と、このワイヤ被覆層の周囲に配置したワイヤ接着剤層と、を備え、前記ワイヤ被覆層が、フッ素系樹脂又はポリアミドイミド系樹脂又は10GHzでの比誘電率が3.6未満の低誘電ポリイミド樹脂の何れか1種類又はこれら2種類以上の組み合わせである絶縁被覆ワイヤ及びこれを用いたマルチワイヤ配線板。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)