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1. (WO2014199910) METHOD FOR MANUFACTURING PATTERN-FORMED BODY
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/199910 International Application No.: PCT/JP2014/065065
Publication Date: 18.12.2014 International Filing Date: 06.06.2014
IPC:
B32B 27/30 (2006.01) ,H05K 3/12 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
30
comprising vinyl resin; comprising acrylic resin
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12
using printing techniques to apply the conductive material
Applicants: DEXERIALS CORPORATION[JP/JP]; Gate City Osaki, East Tower 8F, 1-11-2, Osaki, Shinagawa-ku, Tokyo 1410032, JP
Inventors: ITO, Makiya; JP
ENDO, Ryosuke; JP
YUN, KyungSung; JP
KONDO, Hirofumi; JP
Agent: NOGUCHI, Nobuhiro; Elevage Kandanishikicho 2F, 3-16-11, Kandanishikicho, Chiyoda-ku, Tokyo 1010054, JP
Priority Data:
2013-12281211.06.2013JP
Title (EN) METHOD FOR MANUFACTURING PATTERN-FORMED BODY
(FR) PROCÉDÉ POUR LA FABRICATION DE CORPS FORMÉ À MOTIFS
(JA) パターン形成体の製造方法
Abstract:
(EN)  The present invention provides a method for manufacturing a pattern-formed body in which a pattern having different surface free energies can be obtained in a simple manner. A resin composition (12) containing a first compound, presenting a low surface free energy, and a second compound, presenting a higher surface free energy, is applied onto a base material (11); the resin composition (12) is brought into contact with an original (20) having a pattern corresponding to a surface free energy difference formed thereon and is hardened; and a hardened resin layer to which the pattern on the original (20) is transferred is formed on the base material (11).
(FR) La présente invention concerne un procédé pour la fabrication de corps formé à motifs dans lequel un motif possédant des énergies libres de surface différentes peut être obtenu d'une manière simple. Une composition de résine (12) contenant un premier composé, présentant une énergie libre de surface faible, et un second composé, présentant une énergie libre de surface supérieure, est appliquée sur un matériau de base (11) ; la composition de résine (12) est amenée en contact avec un original (20) comprenant un motif correspondant à une différence d'énergie libre de surface formée sur celui-ci et est durcie ; et une couche de résine durcie vers laquelle le motif sur l'original (20) est transféré est formée sur le matériau de base (11).
(JA)  表面自由エネルギーの異なるパターンを簡便に得ることができるパターン形成体の製造方法を提供する。低い表面自由エネルギーを発現させる第1の化合物と、第1の化合物よりも高い表面自由エネルギーを発現させる第2の化合物とを含有する樹脂組成物(12)を基材(11)上に塗布し、樹脂組成物(12)を表面自由エネルギー差によるパターンが形成された原版(20)に接触させて硬化させ、基材(11)上に原版(20)のパターンが転写された硬化樹脂層を形成する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)