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1. (WO2014199909) HOLDING DEVICE, AND HIGH-SPEED PLATING DEVICE PROVIDED WITH SAME

Pub. No.:    WO/2014/199909    International Application No.:    PCT/JP2014/065051
Publication Date: Fri Dec 19 00:59:59 CET 2014 International Filing Date: Sat Jun 07 01:59:59 CEST 2014
IPC: C25D 17/06
C25D 17/00
C25D 21/00
Applicants: KYB CORPORATION
KYB株式会社
CHUO SEISAKUSHO, LTD.
株式会社中央製作所
Inventors: MOCHIZUKI, Yoshitaka
望月 嘉隆
MIYAZAKI, Toshihisa
宮崎 稔久
TAKAMATSU, Akira
高松 輝
Title: HOLDING DEVICE, AND HIGH-SPEED PLATING DEVICE PROVIDED WITH SAME
Abstract:
Provided is a holding device capable of holding a plurality of types of workpieces, and definitively preventing the leakage of the solution in a solution tank. A holding device (40) is equipped with a holding member (41) for holding an article (workpiece) (1) to be plated, which is positioned so as to extend between a solution tank through which a plating solution (liquid) flows and a holding chamber (45) that is connected to the solution tank, in the holding chamber (45). The holding member (41) has a plurality of contact parts (43) comprising chemically resistant sponge sheets (elastic bodies) (46) for sandwiching and holding the article (workpiece) (1) to be plated by contacting, with no gap interposed therebetween, the same outer-circumferential surface of the article (workpiece) (1) to be plated. Furthermore, a pressurizing device (50) is provided for pressurizing the interior of the holding chamber (45) by blowing air therein while the article (workpiece) (1) to be plated is sandwiched and held by the holding member (41).