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1. (WO2014199661) COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/199661 International Application No.: PCT/JP2014/054139
Publication Date: 18.12.2014 International Filing Date: 21.02.2014
IPC:
C07C 39/10 (2006.01) ,C07C 37/14 (2006.01) ,C08G 61/00 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01)
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
C
ACYCLIC OR CARBOCYCLIC COMPOUNDS
39
Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
02
monocyclic with no unsaturation outside the aromatic ring
10
Polyhydroxy benzenes; Alkylated derivatives thereof
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
C
ACYCLIC OR CARBOCYCLIC COMPOUNDS
37
Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring
11
by reactions increasing the number of carbon atoms
14
by addition reactions, i.e. reactions involving at least one carbon-to-carbon unsaturated bond
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
61
Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
Applicants:
DIC株式会社 DIC CORPORATION [JP/JP]; 東京都板橋区坂下三丁目35番58号 35-58, Sakashita 3-chome, Itabashi-ku, Tokyo 1748520, JP
Inventors:
佐藤 泰 SATOU Yutaka; JP
高橋 歩 TAKAHASHI Ayumi; JP
秋元 源祐 AKIMOTO Gensuke; JP
Agent:
河野 通洋 KONO Michihiro; 東京都千代田区神田淡路町二丁目101番地 ワテラスタワー DIC株式会社内 c/o DIC Corporation, WATERRAS TOWER, 101, Kanda Awajicho 2-chome, Chiyoda-ku, Tokyo 1010063, JP
Priority Data:
2013-12556614.06.2013JP
Title (EN) COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD
(FR) COMPOSÉ CONTENANT UN GROUPE HYDROXYLE PHÉNOLIQUE, RÉSINE PHÉNOLIQUE, COMPOSITION DURCISSABLE, PRODUIT DURCI CONSTITUÉ DE CETTE COMPOSITION, MATIÈRE DE SCELLEMENT SEMI-CONDUCTRICE, ET CARTE DE CIRCUIT IMPRIMÉ
(JA) フェノール性水酸基含有化合物、フェノール樹脂、硬化性組成物、その硬化物、半導体封止材料、及びプリント配線基板
Abstract:
(EN) Provided are: a compound containing a phenolic hydroxyl group and having superior heat resistance and flame retardance of the cured product thereof; a phenolic resin containing same; a curable composition and cured product thereof; a semiconductor sealing material; and a printed circuit board. The phenolic resin is characterized by containing, as required components, a binuclear compound (X) represented by structural formula (I) [in the formula: j and k are each 1 or 2; and at least one of j and k is 2] and a trinuclear compound (Y) represented by structural formula (II) [in the formula: l, m, and n are each 1 or 2; and at least one of l, m, and n is 2].
(FR) L'invention concerne un composé contenant un groupe hydroxyle phénolique et offrant une grande résistance à la chaleur et résistance à la flamme du produit durci constitué de ce composé ; une résine phénolique contenant ce composé ; une composition durcissable et un produit durci constitué de cette composition ; une matière de scellement semi-conductrice ; et une carte de circuit imprimé. La résine phénolique est caractérisée en ce qu'elle contient, comme composés requis, un composé binuclaire (X) représenté par la formule développée (I) [dans cette formule : j et k valent respectivement 1 ou 2 ; et au moins j ou k vaut 2] et un composé trinucléaire (Y) représenté par la formule développée (II) [dans cette formule: l, m et n valent respectivement 1 ou 2; et au moins l, m ou n vaut 2].
(JA) 硬化物における耐熱性及び難燃性に優れるフェノール性水酸基含有化合物、これを含むフェノール樹脂、硬化性組成物とその硬化物、半導体封止材料、及プリント配線基板を提供すること。下記構造式(I) [式中、j、kはそれぞれ1又は2であり、j、kの少なくとも一方は2である。] で表される2核体化合物(X)と、下記構造式(II)[式中、l、m、nはそれぞれ1又は2、であり、l、m、nの少なくとも一つは2である。] で表される3核体化合物(Y)とを必須の成分として含有することを特徴とするフェノール樹脂。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)