WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Options
Query Language
Stem
Sort by:
List Length
1. (WO2014199655) ACTIVE ESTER RESIN CONTAINING PHOSPHORUS ATOM, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/199655 International Application No.: PCT/JP2014/052743
Publication Date: 18.12.2014 International Filing Date: 06.02.2014
IPC:
C08G 63/692 (2006.01) ,C08G 59/40 (2006.01) ,C08J 5/24 (2006.01) ,H05K 1/03 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
63
Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
68
Polyesters containing atoms other than carbon, hydrogen, and oxygen
692
containing phosphorus
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
24
Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants: DIC CORPORATION[JP/JP]; 35-58, Sakashita 3-chome, Itabashi-ku, Tokyo 1748520, JP
Inventors: ARITA Kazuo; JP
SUZUKI Etsuko; JP
Agent: KONO Michihiro; c/o DIC Corporation, WATERRAS TOWER, 101, Kanda Awajicho 2-chome, Chiyoda-ku, Tokyo 1010063, JP
Priority Data:
2013-12175210.06.2013JP
Title (EN) ACTIVE ESTER RESIN CONTAINING PHOSPHORUS ATOM, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM
(FR) RÉSINE D'ESTER ACTIF CONTENANT DES ATOMES DE PHOSPHORE, COMPOSITION DE RÉSINE ÉPOXYDE ET PRODUIT DURCI CORRESPONDANT, PRÉIMPRÉGNÉ, CARTE DE CIRCUITS IMPRIMÉS ET FILM D'ACCUMULATION
(JA) リン原子含有活性エステル樹脂、エポキシ樹脂組成物、その硬化物、プリプレグ、回路基板、及びビルドアップフィルム
Abstract:
(EN) Provided are: an active ester resin containing a phosphorus atom, which enables the provision of a cured article having all of flame retardancy, heat resistance and dielectric properties; an epoxy resin composition containing the active ester resin as a curing agent; a cured product of the epoxy resin composition; a prepreg; a circuit board; and a build-up film. An active ester resin containing a phosphorus atom, which is characterized by having such a structure (I) that a structural unit (α) produced by linking multiple aromatic cores (X) to each other through an aliphatic cyclic hydrocarbon group is linked to another structural unit (α) through an arylene dicarbonyloxy group, wherein at least one of the aromatic cores (X) in the resin has a structural moiety (Y) represented by any one of structural formulae (y1) to (y4) as a substituent on the at least one of the aromatic core.
(FR) L'invention porte sur : une résine d'ester actif contenant des atomes de phosphore, qui permet la production d'un article durci ayant à la fois un caractère ignifuge, de la résistance à la chaleur et des propriétés diélectriques ; une composition de résine époxyde contenant la résine d'ester actif en tant qu'agent durcisseur ; un produit durci de la composition de résine époxyde ; un préimprégné ; une carte de circuits imprimés ; et un film d'accumulation. La résine d'ester actif contenant des atomes de phosphore est caractérisée en ce qu'elle a une structure (I) telle qu'un motif de structure (α) produit par liaison de multiples noyaux aromatiques (X) les uns aux autres par l'intermédiaire d'un groupe hydrocarboné cyclique aliphatique est lié à un autre motif de structure (α) par l'intermédiaire d'un groupe arylènedicarbonyloxy, au moins l'un des noyaux aromatiques (X) dans la résine ayant une fraction de structure (Y) représentée par l'une quelconque des formules de structure (y1) à (y4) en tant que substituant sur ledit ou lesdits noyaux aromatiques.
(JA) 硬化物における難燃性、耐熱性、及び誘電特性の全てを兼備するリン原子含有活性エステル樹脂、これを硬化剤とするエポキシ樹脂組成物、その硬化物、プリプレグ、回路基板、及びビルドアップフィルムを提供する。脂肪族環状炭化水素基を介して芳香核(X)が複数結節された構造ユニット(α)が、アリーレンジカルボニルオキシ基を介して他の構造ユニット(α)と結節した構造(I)を有し、樹脂中に存在する前記芳香核(X)の少なくとも一つが下記構造式(y1)~(y4)の何れかで表される構造部位(Y)を芳香核上の置換基として有することを特徴とするリン原子含有活性エステル樹脂。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)