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1. (WO2014199650) THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING THERMALLY CONDUCTIVE SHEET, AND POWER MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/199650 International Application No.: PCT/JP2014/050321
Publication Date: 18.12.2014 International Filing Date: 10.01.2014
IPC:
C08L 101/00 (2006.01) ,C08J 5/18 (2006.01) ,C08K 3/38 (2006.01) ,H01L 23/36 (2006.01) ,H01L 25/07 (2006.01) ,H01L 25/18 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
38
Boron-containing compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
Applicants: MITSUBISHI ELECTRIC CORPORATION[JP/JP]; 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310, JP
Inventors: TAKAHARA, Mariko; JP
MIMURA, Kenji; JP
NAKAMURA, Yurie; JP
MASAKI, Motoki; JP
Agent: SOGA, Michiharu; S. Soga & Co., 8th Floor, Kokusai Building, 1-1, Marunouchi 3-chome, Chiyoda-ku, Tokyo 1000005, JP
Priority Data:
2013-12548014.06.2013JP
Title (EN) THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING THERMALLY CONDUCTIVE SHEET, AND POWER MODULE
(FR) COMPOSITION DE RÉSINE THERMODURCISSABLE, PROCÉDÉ DE PRODUCTION DE FEUILLE CONDUISANT LA CHALEUR ET MODULE D'ALIMENTATION
(JA) 熱硬化性樹脂組成物、熱伝導性シートの製造方法、及びパワーモジュール
Abstract:
(EN) The present invention is a thermosetting resin composition containing a thermosetting resin and an inorganic filler, which is characterized by containing (A) secondary particles that are formed of primary particles of boron nitride having an aspect ratio of from 10 to 20 (inclusive) and (B) secondary particles that are formed of primary particles of boron nitride having an aspect ratio of from 2 to 9 (inclusive). This thermosetting resin composition is able to provide a thermally conductive sheet which has excellent thermal conductivity, bondability and electrical insulating properties, while exhibiting good filling properties of the inorganic filler.
(FR) La présente invention concerne une composition de résine thermodurcissable contenant une résine thermodurcissable et une charge inorganique, caractérisée en ce qu'elle contient (A) des particules secondaires formées à partir de particules primaires de nitrure de bore ayant un rapport d'aspect de 10 à 20 (inclus), et (B) des particules secondaires formées à partir de particules primaires de nitrure de bore ayant un rapport d'aspect de 2 à 9 (inclus). Une telle composition de résine thermodurcissable est apte à former une feuille conduisant la chaleur dotée de propriétés de conductivité thermique, d'aptitude au soudage et d'isolation électrique excellentes, tout en offrant de bonnes propriétés de charge de la charge inorganique.
(JA)  本発明は、熱硬化性樹脂及び無機充填材を含む熱硬化性樹脂組成物であって、前記無機充填材が、10以上20以下のアスペクト比を有する窒化ホウ素の一次粒子から形成される二次粒子(A)と、2以上9以下のアスペクト比を有する窒化ホウ素の一次粒子から形成される二次粒子(B)とを含むことを特徴とする熱硬化性樹脂組成物である。この熱硬化性樹脂組成物は、無機充填材の充填性が良好であり、熱伝導性、接着性及び電気絶縁性に優れた熱伝導性シートを与えることができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)