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1. (WO2014197881) COMPONENT PLACEMENT WITHIN A SOLID STATE DRIVE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2014/197881    International Application No.:    PCT/US2014/041432
Publication Date: 11.12.2014 International Filing Date: 06.06.2014
IPC:
G11B 33/12 (2006.01)
Applicants: WESTERN DIGITAL TECHNOLOGIES, INC. [US/US]; 3355 Michelson Drive Suite 100 Irvine, California 92612 (US)
Inventors: SARRAF, Mohammad; (US).
VU, Billy Hung; (US).
MYERS, John P.; (US)
Agent: CHAN, David H.; Western Digital Technologies, Inc. 3355 Michelson Drive Suite 100 Irvine, California 92612 (US)
Priority Data:
61/832,707 07.06.2013 US
14/089,991 26.11.2013 US
Title (EN) COMPONENT PLACEMENT WITHIN A SOLID STATE DRIVE
(FR) PLACEMENT DE COMPOSANT DANS UN DISQUE DUR ÉLECTRONIQUE
Abstract: front page image
(EN)A component mount for a data storage device (DSD). The component mount includes a flexible member or printed circuit board assembly (PCBA) including a pad for electrically connecting to a printed circuit board (PCB) of the DSD. At least one capacitor is mounted on the flexible member or PCBA, and is electrically connected with the pad.
(FR)L'invention concerne un support pour composant destiné à un dispositif de mémorisation de données (DSD). Ledit support pour composant comporte un élément souple ou un ensemble carte de circuit imprimé (PCBA) comprenant une pastille qui sert à la connexion électrique avec une carte de circuit imprimé (PCB) du DSD. Au moins un condensateur est monté sur l'élément souple ou le PCBA et est connecté électriquement à la pastille.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)