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1. (WO2014197808) COMPOSITIONS AND METHODS FOR SELECTIVELY ETCHING TITANIUM NITRIDE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/197808 International Application No.: PCT/US2014/041322
Publication Date: 11.12.2014 International Filing Date: 06.06.2014
IPC:
C09K 13/00 (2006.01) ,G03F 7/32 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
13
Etching, surface-brightening or pickling compositions
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26
Processing photosensitive materials; Apparatus therefor
30
Imagewise removal using liquid means
32
Liquid compositions therefor, e.g. developers
Applicants:
ADVANCED TECHNOLOGY MATERIALS, INC. [US/US]; 7 Commerce Drive Danbury, Connecticut 06810, US
Inventors:
CHEN, Li-Min; US
LIPPY, Steven; US
COOPER, Emanuel I.; US
SONG, Lingyan; US
Agent:
FUIERER, Tristan; Moore & Van Allen, PLLC P.O. Box 13706 Research Triangle Park, North Carolina 27709, US
Priority Data:
61/831,92806.06.2013US
Title (EN) COMPOSITIONS AND METHODS FOR SELECTIVELY ETCHING TITANIUM NITRIDE
(FR) COMPOSITIONS ET PROCÉDÉS POUR L'ATTAQUE SÉLECTIVE DE NITRURE DE TITANE
Abstract:
(EN) Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., cobalt, ruthenium and copper, and insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant and one etchant, may contain various corrosion inhibitors to ensure selectivity.
(FR) L'invention concerne des compositions utiles pour l'élimination sélective de nitrure de titane et/ou des matières de résidu d'attaque de résine photosensible par rapport à des matériaux conducteurs métalliques, par exemple le cobalt, le ruthénium et le cuivre, et à des matériaux isolants d'un dispositif microélectronique sur lequel se trouvent ces matériaux. Ces compositions d'élimination contiennent au moins un oxydant et un agent d'attaque, et peuvent contenir divers inhibiteurs de corrosion pour assurer la sélectivité.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)