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1. (WO2014196502) PHOTOCURABLE THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD

Pub. No.:    WO/2014/196502    International Application No.:    PCT/JP2014/064632
Publication Date: Fri Dec 12 00:59:59 CET 2014 International Filing Date: Tue Jun 03 01:59:59 CEST 2014
IPC: G03F 7/032
C08G 59/42
G03F 7/004
G03F 7/038
H05K 3/28
Applicants: TAIYO INK MFG. CO., LTD.
太陽インキ製造株式会社
Inventors: UETA, Chiho
植田 千穂
Title: PHOTOCURABLE THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD
Abstract:
A photocurable thermosetting resin composition which contains (A) a carboxyl group-containing resin, (B) a polyfunctional epoxy resin having a softening point of 60°C or less, (B') a polyfunctional epoxy resin having a softening point of more than 60°C, (C) a photopolymerization initiator and (D) a coloring agent. This photocurable thermosetting resin composition is characterized in that: the total of (B1) the epoxy groups in (B) the polyfunctional epoxy resin having a softening point of 60°C or less and (B'1) the epoxy groups in (B') the polyfunctional epoxy resin having a softening point of more than 60°C is from 0.8 to 2.2 equivalents (inclusive) per 1 equivalent of the carboxyl groups in (A) the carboxyl group-containing resin; and the transmittance of a dried coating film, which is formed using this photocurable thermosetting resin composition and has a film thickness of 20 μm, at a wavelength of 600 nm is 25% or less.