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1. (WO2014196297) UNDERFILL MATERIAL, LAMINATE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Pub. No.:    WO/2014/196297    International Application No.:    PCT/JP2014/062145
Publication Date: Fri Dec 12 00:59:59 CET 2014 International Filing Date: Sat May 03 01:59:59 CEST 2014
IPC: H01L 21/60
C09J 7/02
C09K 3/10
H01L 21/301
H01L 21/304
Applicants: NITTO DENKO CORPORATION
日東電工株式会社
Inventors: FUKUI, Akihiro
福井 章洋
TAKAMOTO, Naohide
高本 尚英
HANAZONO, Hiroyuki
花園 博行
MORITA, Kosuke
盛田 浩介
Title: UNDERFILL MATERIAL, LAMINATE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Abstract:
 Provided are: an underfill material including a flux component, the underfill material having heat storage stability allowing flux activity to be maintained even after loading by a heat history, and having excellent non-migrating properties such that migration over time to another adhesive layer is suppressed; a laminate sheet provided with the underfill material; and a method for manufacturing a semiconductor device. The present invention is an underfill material including, as a flux component, an aromatic compound having a molecular weight of at least 300 and having at least one ester bond within the molecule. The flux component undergoes a reduction in weight of less than 50% relative to the initial content after the underfill material has been heated for one hour at 100°C.