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|1. (WO2014196297) UNDERFILL MATERIAL, LAMINATE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE|
|Applicants:||NITTO DENKO CORPORATION
|Title:||UNDERFILL MATERIAL, LAMINATE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE|
Provided are: an underfill material including a flux component, the underfill material having heat storage stability allowing flux activity to be maintained even after loading by a heat history, and having excellent non-migrating properties such that migration over time to another adhesive layer is suppressed; a laminate sheet provided with the underfill material; and a method for manufacturing a semiconductor device. The present invention is an underfill material including, as a flux component, an aromatic compound having a molecular weight of at least 300 and having at least one ester bond within the molecule. The flux component undergoes a reduction in weight of less than 50% relative to the initial content after the underfill material has been heated for one hour at 100°C.