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1. (WO2014196296) METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Pub. No.:    WO/2014/196296    International Application No.:    PCT/JP2014/062144
Publication Date: Fri Dec 12 00:59:59 CET 2014 International Filing Date: Sat May 03 01:59:59 CEST 2014
IPC: H01L 21/56
C07D 303/27
H01L 21/60
H01L 23/12
Applicants: NITTO DENKO CORPORATION
日東電工株式会社
Inventors: TOYODA, Eiji
豊田 英志
KAMEYAMA, Kojiro
亀山 工次郎
MATSUMURA, Takeshi
松村 健
ODA, Takashi
小田 高司
Title: METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Abstract:
A method for manufacturing a semiconductor device, which comprises: a step A for preparing a laminate wherein at least a sheet for temporary joint and a wiring sheet that is provided with a rewiring layer are laminated; a step B for flip-chip mounting a semiconductor chip on the wiring sheet of the laminate; a step C for preparing a sealing sheet that is obtained by plastic working of a kneaded material that is obtained by kneading an epoxy resin, a curing agent and an inorganic filler; a step D for burying the semiconductor chip into the sealing sheet by disposing the sealing sheet on the surface where the semiconductor chip is exposed; a step E for thermally curing the sealing sheet; and a step F for separating the sheet for temporary joint from the wiring sheet.