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|1. (WO2014196296) METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE|
|Applicants:||NITTO DENKO CORPORATION
|Title:||METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE|
A method for manufacturing a semiconductor device, which comprises: a step A for preparing a laminate wherein at least a sheet for temporary joint and a wiring sheet that is provided with a rewiring layer are laminated; a step B for flip-chip mounting a semiconductor chip on the wiring sheet of the laminate; a step C for preparing a sealing sheet that is obtained by plastic working of a kneaded material that is obtained by kneading an epoxy resin, a curing agent and an inorganic filler; a step D for burying the semiconductor chip into the sealing sheet by disposing the sealing sheet on the surface where the semiconductor chip is exposed; a step E for thermally curing the sealing sheet; and a step F for separating the sheet for temporary joint from the wiring sheet.