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1. (WO2014194560) EPOXY MICROCAPSULE AND PREPARATION METHOD THEREOF

Pub. No.:    WO/2014/194560    International Application No.:    PCT/CN2013/080880
Publication Date: Fri Dec 12 00:59:59 CET 2014 International Filing Date: Wed Aug 07 01:59:59 CEST 2013
IPC: C08G 59/50
C08L 63/00
B01J 13/02
Applicants: SHENZHEN UNIVERSITY
深圳大学
Inventors: ZHU, Guangming
朱光明
ZHOU, Yuming
周玉明
TANG, Jiaoning
汤皎宁
DONG, Biqin
董必钦
WANG, Xianfeng
王险峰
HAN, Ningxu
韩宁旭
XING, Feng
邢峰
Title: EPOXY MICROCAPSULE AND PREPARATION METHOD THEREOF
Abstract:
The present invention is applicable to the field of microcapsule preparation and self-repairing materials. Provided is an epoxy resin microcapsule. The epoxy resin microcapsule comprises a capsule core and a capsule wall, wherein the capsule core consists of an epoxy resin or a mixture containing an epoxy resin; the capsule wall is obtained through a reaction between a part of the epoxy resin from the capsule core and a curing agent. The invention also provides a preparation method for the epoxy resin microcapsule. The preparation method of the epoxy resin microcapsule provided in the invention has a simple process.