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1. (WO2014194540) SYSTEM FOR CUTTING GLASS SUBSTRATE

Pub. No.:    WO/2014/194540    International Application No.:    PCT/CN2013/078176
Publication Date: Fri Dec 12 00:59:59 CET 2014 International Filing Date: Fri Jun 28 01:59:59 CEST 2013
IPC: C03B 33/02
C03B 33/03
Applicants: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
深圳市华星光电技术有限公司
Inventors: HUANG, Haibo
黄海波
Title: SYSTEM FOR CUTTING GLASS SUBSTRATE
Abstract:
A system for cutting glass substrate comprises an upstream suction platform, a downstream suction platform, a moving device, an upper cutting head, a lower cutting head and a discharging device arranged between the upstream suction platform and the downstream suction platform. The discharging device comprises: a vacuum pump; a suction plate provided with a through-hole, the bottom of the suction plate being connected with an adsorption chamber, and the adsorption chamber being communicated with the through-hole and the vacuum pump respectively so that an excess material part placed on the surface of the suction plate is adsorbed to the suction plate; a displacement component connected with the suction plate, used for driving the suction plate adsorbed with the excess material part to rotate, thereby removing the excess material part.