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1. WO2014194095 - COMBINED IMAGING AND SCATTEROMETRY METROLOGY

Publication Number WO/2014/194095
Publication Date 04.12.2014
International Application No. PCT/US2014/040030
International Filing Date 29.05.2014
IPC
G01N 21/47 2006.01
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
17Systems in which incident light is modified in accordance with the properties of the material investigated
47Scattering, i.e. diffuse reflection
G01N 21/84 2006.01
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
84Systems specially adapted for particular applications
G01N 11/00 2006.01
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
11Investigating flow properties of materials, e.g. viscosity or plasticity; Analysing materials by determining flow properties
G06T 7/00 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
7Image analysis
CPC
G01N 21/47
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
17Systems in which incident light is modified in accordance with the properties of the material investigated
47Scattering, i.e. diffuse reflection
G01N 21/4785
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
17Systems in which incident light is modified in accordance with the properties of the material investigated
47Scattering, i.e. diffuse reflection
4785Standardising light scatter apparatus; Standards therefor
G01N 21/9501
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
95characterised by the material or shape of the object to be examined
9501Semiconductor wafers
G01N 2201/02
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
2201Features of devices classified in G01N21/00
02Mechanical
G01N 2201/12
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
2201Features of devices classified in G01N21/00
12Circuits of general importance; Signal processing
G03F 7/70633
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
70633Overlay
Applicants
  • KLA-TENCOR CORPORATION [US]/[US]
Inventors
  • AMIT, Eran
  • YOHANAN, Raviv
Agents
  • MCANDREWS, Kevin
Priority Data
61/829,13930.05.2013US
61/830,72904.06.2013US
61/977,07508.04.2014US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) COMBINED IMAGING AND SCATTEROMETRY METROLOGY
(FR) MÉTROLOGIE D'IMAGERIE ET DE DIFFUSIOMÉTRIE COMBINÉES
Abstract
(EN)
Metrology targets, design files, and design and production methods thereof are provided. The targets comprise two or more parallel periodic structures at respective layers, wherein a predetermined offset is introduced between the periodic structures, for example, opposite offsets at different parts of a target. Quality metrics are designed to estimate the unintentional overlay from measurements of a same metrology parameter by two or more alternative measurement algorithms. Target parameters are configured to enable both imaging and scatterometry measurements and enhance the metrology measurements by the use of both methods on the same targets. Imaging and scatterometry target parts may share elements or have common element dimensions. Imaging and scatterometry target parts may be combined into a single target area or may be integrated into a hybrid target using a specified geometric arrangement.
(FR)
L'invention concerne des cibles métrologiques, des fichiers de conception et des procédés de conception et de production associés. Les cibles comprennent deux structures périodiques parallèles ou plus au niveau de couches respectives, un décalage prédéterminé étant introduit entre les structures périodiques, par exemple, des décalages opposés au niveau de différentes parties d'une cible. Les mesures de qualité sont conçues pour estimer le recouvrement involontaire à partir de mesures d'un même paramètre métrologique par deux autres algorithmes de mesure ou plus. Les paramètres des cibles sont configurés pour permettre à la fois des mesures d'imagerie et de diffusiométrie et améliorer les mesures métrologiques à l'aide des deux procédés sur les mêmes cibles. Les parties de cibles d'imagerie et de diffusiométrie peuvent partager des éléments ou avoir des dimensions d'éléments communes. Les parties de cibles d'imagerie et de diffusiométrie peuvent être combinées en une seule zone cible ou peuvent être intégrées dans une cible hybride utilisant un agencement géométrique spécifié.
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