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1. (WO2014192839) CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/192839 International Application No.: PCT/JP2014/064201
Publication Date: 04.12.2014 International Filing Date: 21.05.2014
IPC:
C08G 59/68 (2006.01) ,C08L 63/00 (2006.01) ,C09K 3/10 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
68
characterised by the catalysts used
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
10
for sealing or packing joints or covers
Applicants: DAICEL CORPORATION[JP/JP]; 3-1, Ofuka-cho, Kita-ku, Osaka-shi, Osaka 5300011, JP
Inventors: MARUKAWA, Masanori; JP
EGAWA, Tomoya; JP
SHIBAMOTO, Akihiro; JP
Agent: GOTO, Yukihisa; Minamimorimachi Kyodo Bldg., 2nd Floor, 2-18, Kobai-cho, Kita-ku, Osaka-shi, Osaka 5300038, JP
Priority Data:
2013-11176328.05.2013JP
2014-01080823.01.2014JP
Title (EN) CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR
(FR) COMPOSITION DURCISSABLE POUR SCELLER UN SEMICONDUCTEUR OPTIQUE
(JA) 光半導体封止用硬化性組成物
Abstract:
(EN) This curable composition for sealing an optical semiconductor is characterized by containing components (A), (B), and (C) mentioned below. The curable composition for sealing an optical semiconductor is characterized in that, in addition to the components (A), (B), and (C), said curable composition further contains component (D) mentioned below. Component (A): a compound comprising at least one functional group selected from the group consisting of an epoxy group, an oxetanyl group, a vinyl ether group, and a (meth)acryloyl group. Component (B): an alicyclic epoxy compound. Component (C): a curing catalyst that generates acid by light or heat, and includes a cation constituent comprising an aromatic ring, and an anion constituent having boron or phosphorus as a central element. Component (D): conductive-fiber-coated particles comprising a particulate material and a fibrous conductive material that covers said particulate material.
(FR) L'invention concerne une composition durcissable pour sceller un semiconducteur optique qui se caractérise en ce qu'elle contient les composants (A), (B) et (C) mentionnés ci-dessous. La composition durcissable pour sceller un semiconducteur optique se caractérise en ce que, outre les composants (A), (B) et (C), ladite composition durcissable contient le composant (D) mentionné ci-dessous. Composant (A) : composé comprenant au moins un groupe fonctionnel choisi dans l'ensemble consistant en un groupe époxy, un groupe oxétanyle, un groupe éther vinylique et un groupe (méth)acryloyle. Composant (B) : composé époxy alicyclique. Composant (C) : catalyseur de durcissement qui génère un acide en présence de lumière ou de chaleur et comprend un constituant cationique comprenant un cycle aromatique et un constituant anionique ayant du bore ou du phosphore comme élément central. Composant (D) : particules revêtues de fibres conductrices comprenant un matériau particulaire et un matériau conducteur fibreux qui couvre ledit matériau particulaire.
(JA)  本発明の光半導体封止用硬化性組成物は、下記成分(A)、(B)、及び(C)を含むことを特徴とする。また、本発明の光半導体封止用硬化性組成物は、上記成分(A)、(B)及び(C)に加え、さらに下記成分(D)を含むことを特徴とする。 成分(A):エポキシ基、オキセタニル基、ビニルエーテル基及び(メタ)アクリロイル基からなる群より選ばれる1以上の官能基を有する化合物 成分(B):脂環エポキシ化合物 成分(C):芳香環を有するカチオン成分を有し、且つ、中心元素がホウ素又はリンであるアニオン成分を有する光又は熱により酸を発生する硬化触媒 成分(D):粒子状物質と該粒子状物質を被覆する繊維状の導電性物質を含む導電性繊維被覆粒子
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)