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Machine translation
1. (WO2014192449) METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2014/192449    International Application No.:    PCT/JP2014/060709
Publication Date: 04.12.2014 International Filing Date: 15.04.2014
IPC:
H01L 33/56 (2010.01)
Applicants: SHARP KABUSHIKI KAISHA [JP/JP]; 22-22, Nagaike-cho, Abeno-ku, Osaka-shi, Osaka 5458522 (JP)
Inventors: KONISHI, Masahiro; .
ITOH, Masayuki; .
UMEDA, Hiroshi; .
TAMAKI, Kazuo; .
OKANO, Masanobu;
Agent: HARAKENZO WORLD PATENT & TRADEMARK; Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041 (JP)
Priority Data:
2013-112289 28.05.2013 JP
Title (EN) METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE
(FR) PROCÉDÉ DE FABRICATION D'UN DISPOSITIF ÉMETTEUR DE LUMIÈRE
(JA) 発光装置の製造方法
Abstract: front page image
(EN)This method for manufacturing a light-emitting device includes a step in which a solid sealing resin (17) containing a phosphor (18) and a solid sealing resin (17) containing a phosphor (19) are placed in a recess of a package resin (14) on which an LED chip is placed, melted by heating, and hardened by heating.
(FR)Ce procédé de fabrication d'un dispositif émetteur de lumière comprend une étape dans laquelle une résine d'étanchéité solide (17) contenant un phosphore (18) et une résine d'étanchéité solide (17) contenant un phosphore (19) sont placées dans une découpe d'une résine de conditionnement (14) sur laquelle une puce LED est disposée, fondu par chauffage et durci par chauffage.
(JA) 本発明の発光装置の製造方法は、蛍光体(18)を含有した固体状の封止樹脂(17)と、蛍光体(19)を含有した固体状の封止樹脂(17)とをLEDチップが載置されたパッケージ樹脂(14)の凹部に配置した後、加熱により溶融し、さらに、加熱することで硬化するステップを含む。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)