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Pub. No.: WO/2014/192336 International Application No.: PCT/JP2014/054341
Publication Date: 04.12.2014 International Filing Date: 24.02.2014
G06F 3/041 (2006.01) ,G06F 3/044 (2006.01)
Applicants: SHARP KABUSHIKI KAISHA[JP/JP]; 22-22, Nagaike-cho, Abeno-ku, Osaka-shi, Osaka 5458522, JP
Inventors: KIDA, Kazutoshi; null
MIYAMOTO, Masayuki; null
ITOH Motomitsu; null
YOSHIMURA, Kazuya; null
Agent: HARAKENZO WORLD PATENT & TRADEMARK; Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041, JP
Priority Data:
(JA) タッチパネル基板
Abstract: front page image
(EN) Provided is a touch panel substrate capable of preventing the destruction of a detection circuit caused by the application of an electrostatic voltage. The touch panel substrate comprises a flexible substrate (20) for electrically connecting a sensor electrode (12) and a touch controller (32). One end of the flexible substrate (20) is connected to a terminal section (13) comprising a sensor electrode (12) terminal. A shielding electrode (14) is provided on the outside of the terminal section (13).
(FR) L'invention concerne un substrat pour écran tactile capable de prévenir la destruction d'un circuit de détection provoquée par l'application d'une tension électrostatique. Le substrat pour écran tactile comprend un substrat souple (20) pour permettre le raccordement électrique d'une électrode (12) du capteur et d'un dispositif de commande tactile. Une extrémité du substrat souple (20) est raccordée à une section borne (13) comprenant la borne de l'électrode (12) du capteur. Une électrode de protection (14) est ménagée à l'extérieur de la section borne (13).
(JA) 静電気の電圧が印加されることによる検出回路の破壊を防止することができるタッチパネル基板を提供する。センサー電極(12)とタッチコントローラー(32)とを電気的に接続するためのフレキシブル基板(20)を備え、フレキシブル基板(20)の一端は、センサー電極(12)の端子からなる端子部(13)と接続されており、端子部(13)の外側には、遮蔽電極(14)が設けられている。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)