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1. (WO2014192287) COMPOSITION FOR FORMING ELECTROLESS PLATING UNDERLAYER FILM

Pub. No.:    WO/2014/192287    International Application No.:    PCT/JP2014/002782
Publication Date: Fri Dec 05 00:59:59 CET 2014 International Filing Date: Wed May 28 01:59:59 CEST 2014
IPC: C23C 18/20
C09D 5/00
C09D 129/14
C09D 175/04
C09D 179/00
Applicants: IDEMITSU KOSAN CO.,LTD.
出光興産株式会社
Inventors: ARAI, Naoko
荒井 直子
NAKAMURA, Mitsutake
中村 師健
ONODERA, Shingo
小野寺 真吾
FUKATSU, Fumioki
深津 文起
Title: COMPOSITION FOR FORMING ELECTROLESS PLATING UNDERLAYER FILM
Abstract:
A composition for forming an electroless plating underlayer film, which comprises an electrically conductive polymer and a polyvinyl acetal resin.