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1. (WO2014192209) SPUTTERING DEVICE

Pub. No.:    WO/2014/192209    International Application No.:    PCT/JP2014/001878
Publication Date: Fri Dec 05 00:59:59 CET 2014 International Filing Date: Tue Apr 01 01:59:59 CEST 2014
IPC: C23C 14/34
Applicants: CANON ANELVA CORPORATION
キヤノンアネルバ株式会社
Inventors: YAMADA, Satoshi
山田 聡
HIGASHISAKA, Ryuji
東坂 隆嗣
Title: SPUTTERING DEVICE
Abstract:
A sputtering device is provided with: a vacuum vessel; a substrate holder that can dispose a substrate in a prescribed position within the vacuum vessel; a target support body that can dispose a target so as to face the substrate disposed by the substrate holder; a cathode magnet disposed on the opposite side of the target support body from the substrate; a magnet moving unit that adjusts the distance between the cathode magnet and the target support body; a target moving unit that adjusts the distance between the target support body and the substrate; and a control unit that controls the target moving unit and the magnet moving unit.