WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Options
Query Language
Stem
Sort by:
List Length
Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2014191421) MULTILAYER WIRING SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/191421 International Application No.: PCT/EP2014/060976
Publication Date: 04.12.2014 International Filing Date: 27.05.2014
IPC:
H05K 1/03 (2006.01) ,C03C 14/00 (2006.01) ,H05K 3/46 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
C
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
14
Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants: EPCOS AG[DE/DE]; St.-Martin-Str. 53 81669 München, DE
Inventors: KOBUKE, Hisashi; JP
FUTAMATA, Yousuke; JP
NINOMIYA, Emi; JP
Agent: ASSOCIATION NO. 175; EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH; Schlossschmidstr. 5 80639 München, DE
Priority Data:
2013-11581831.05.2013JP
Title (EN) MULTILAYER WIRING SUBSTRATE
(FR) SUBSTRAT DE CÂBLAGE MULTICOUCHE
Abstract:
(EN) To provide a thin glass ceramic multilayer wiring substrate which has excellent substrate strength, with which various electronic components such as ICs can be mounted in a stable manner, and which handles various low-profile modules. [Means of overcoming the problem] A glass ceramic multilayer wiring substrate in which a first aspect ratio representing an oblateness/sphericity of an external filler contained in outside insulating layers is larger than a second aspect ratio representing an oblateness/sphericity of an internal filler contained in the abovementioned inside insulating layers, and a thermal expansion coefficient of the abovementioned outside insulating layers is smaller than a thermal expansion coefficient of the abovementioned inside insulating layers.
(FR) La présente invention consiste à fournir un substrat de câblage multicouche en vitrocéramique mince qui possède une excellente résistance du substrat, avec lequel divers composants électroniques tels que des circuits intégrés peuvent être montés de manière stable, et qui gère divers modules à profil bas. La solution proposée consiste en un substrat de câblage multicouche en vitrocéramique dans lequel un premier rapport d'aspect représentant un aplatissement/une sphéricité d'une charge externe contenue dans des couches isolantes externes est supérieur à un second rapport d'aspect représentant un aplatissement/une sphéricité d'une charge interne contenue dans les couches isolantes internes susmentionnées, et un coefficient de dilatation thermique des couches isolantes externes susmentionnées est inférieur à un coefficient de dilatation thermique des couches isolantes internes susmentionnées.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)