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1. (WO2014188816) SOFT MAGNETIC RESIN COMPOSITION AND SOFT MAGNETIC FILM
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2014/188816    International Application No.:    PCT/JP2014/060600
Publication Date: 27.11.2014 International Filing Date: 14.04.2014
IPC:
H01F 1/22 (2006.01), H01F 1/147 (2006.01)
Applicants: NITTO DENKO CORPORATION [JP/JP]; 1-2, Shimo-hozumi 1-chome, Ibaraki-shi, Osaka 5678680 (JP)
Inventors: MASUDA, Shotaro; (JP).
EBE, Hirofumi; (JP).
HABU, Takashi; (JP)
Agent: OKAMOTO, Hiroyuki; c/o IKUMI PATENT ATTORNEYS OFFICE, Central Shin-Osaka Building 3rd Floor, 5-36, Miyahara 4-chome, Yodogawa-ku, Osaka-shi, Osaka 5320003 (JP)
Priority Data:
2013-107870 22.05.2013 JP
2013-170630 20.08.2013 JP
Title (EN) SOFT MAGNETIC RESIN COMPOSITION AND SOFT MAGNETIC FILM
(FR) COMPOSITION DE RÉSINE MAGNÉTIQUE DOUCE ET FILM MAGNÉTIQUE DOUX
(JA) 軟磁性樹脂組成物および軟磁性フィルム
Abstract: front page image
(EN)A soft magnetic resin composition contains flat, soft magnetic particles and a thermosetting resin component, the average grain size of the soft magnetic particles is 100-300 µm, the average thickness of the soft magnetic particles is 0.5-2.0 µm, and the content (solids) of the soft magnetic particles is at least 50% by volume.
(FR)La présente invention concerne une composition de résine magnétique douce qui contient des particules magnétiques plates et douces et un constituant résine thermodurcissable, la granulométrie moyenne des particules magnétiques douces étant de 100-300 µm, l'épaisseur moyenne des particules magnétiques douces étant de 0,5-2,0 µm et la teneur (en matières solides) des particules magnétiques douces représentant au moins 50% en volume.
(JA) 軟磁性樹脂組成物は、扁平状の軟磁性粒子および熱硬化性樹脂成分を含有し、軟磁性粒子の平均粒子径が、100μm以上300μm以下であり、軟磁性粒子の平均厚みが、0.5μm以上2.0μm以下であり、軟磁性粒子の含有割合(固形分)が、50体積%以上である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)