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1. (WO2014187610) ADAPTER FOR LED MODULES OF THE PACKAGE/ARRAY TYPE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2014/187610    International Application No.:    PCT/EP2014/057249
Publication Date: 27.11.2014 International Filing Date: 10.04.2014
IPC:
F21V 29/00 (2006.01), F21V 19/00 (2006.01)
Applicants: A.A.G. STUCCHI S.R.L. [IT/IT]; Via IV Novembre, 30/32 I-23854 Olginate (IT)
Inventors: STUCCHI, Antonietta; (IT)
Agent: MODIANO, Micaela; Modiano & Partners Via Meravigli, 16 I-20123 Milano (IT)
Priority Data:
MI2013A000843 24.05.2013 IT
Title (EN) ADAPTER FOR LED MODULES OF THE PACKAGE/ARRAY TYPE
(FR) ADAPTATEUR POUR MODULES LED DE TYPE MATRICIEL
Abstract: front page image
(EN)An adapter (1) for LED modules of the package/array type, comprising an adapter body (3) that is provided with a cavity (5) adapted to accommodate an LED module (7) of the package/array type and is associable with a heat sink; a heat dissipation interface element can be inserted between the LED module (7) and the heat sink; the adapter comprising means (20) for retaining the LED module (7), which are adapted to engage the face (71) of the LED module (7) that is directed toward the heat sink, in order to retain the LED module (7) within the cavity (5).
(FR)L'invention concerne un adaptateur (1) de modules LED de type matriciel, comprenant un corps d'adaptateur (3) fourni avec une cavité (5) conçue pour contenir un module LED (7) de type matriciel. L'adaptateur (1) peut être associé à un puits de chaleur; un élément d'interface de dissipation thermique peut être inséré entre le module LED (7) et le puits de chaleur. Pour retenir le module (7) dans la cavité (5), l'adaptateur comprend des moyens de fixation (20) du module LED (7) qui sont conçus pour entrer en contact avec la surface (71) du module LED (7) dirigée vers le puits de chaleur.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)