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Pub. No.:    WO/2014/184927    International Application No.:    PCT/JP2013/063674
Publication Date: 20.11.2014 International Filing Date: 16.05.2013
H01L 21/677 (2006.01)
Applicants: SHIMADZU CORPORATION [JP/JP]; 1, Nishinokyo-kuwabaracho, Nakagyo-ku, Kyoto-shi, Kyoto 6048511 (JP)
Inventors: TAKEDA, Naoya; (JP)
Agent: MIYOSHI, Hidekazu; Toranomon Kotohira Tower, 2-8, Toranomon 1-chome, Minato-ku, Tokyo 1050001 (JP)
Priority Data:
(JA) 基板処理システム
Abstract: front page image
(EN)The present invention is provided with: a transfer apparatus that transfers a substrate to a substrate carrier; a processing apparatus that processes the substrate mounted on the substrate carrier; and a transport apparatus, which transports the substrate carrier between the transfer apparatus and the processing apparatus, and which has a heat-retaining mechanism at least on a part of a first transport path for transporting the substrate carrier to the processing apparatus from the transfer apparatus, said heat-retaining mechanism suppressing temperature reduction of the substrate carrier.
(FR)La présente invention concerne : un appareil de transfert qui transfère un substrat vers un porte-substrat ; un appareil de traitement qui traite le substrat monté sur le porte-substrat ; et un appareil de transport qui transporte le porte-substrat entre l'appareil de transfert et l'appareil de traitement, et qui présente un mécanisme de rétention de chaleur au moins sur une partie d'un premier chemin de transport servant à transporter le porte-substrat de l'appareil de transfert vers l'appareil de traitement, ledit mécanisme de rétention de chaleur supprimant la réduction de température du porte-substrat.
(JA) 基板を基板キャリアに移載する移載装置と、基板キャリアに装着された基板を処理対象とする処理装置と、移載装置と処理装置間で基板キャリアを搬送し、移載装置から処理装置に基板キャリアを搬送する第1の搬送路の少なくとも一部に基板キャリアの温度低下を抑制する保温機構を有する搬送装置とを備える。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)