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Pub. No.:    WO/2014/184844    International Application No.:    PCT/JP2013/063294
Publication Date: 20.11.2014 International Filing Date: 13.05.2013
H01S 5/022 (2006.01)
Applicants: MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310 (JP)
Inventors: KURAMOTO, Kyosuke; (JP).
YANAGISAWA, Takayuki; (JP)
Agent: TAZAWA, Hideaki; Akasaka Sanno Center Bldg. 5F, 12-4, Nagata-cho 2-chome, Chiyoda-ku, Tokyo 1000014 (JP)
Priority Data:
(JA) 半導体レーザ装置
Abstract: front page image
(EN)For at least one of a plurality of openings (10a, 10b), the thickness (t) of a submount (8) and the shortest horizontal distance (x) between the edge of said opening and the edge of the submount satisfy relation (1), and for at least one other opening, said thickness (t) and shortest horizontal distance (x) satisfy relation (2).
(FR)L'invention concerne un dispositif laser à semiconducteur. Pour au moins une parmi une pluralité d'ouvertures (10a, 10b), l'épaisseur (t) d'un sous-support (8) et la distance horizontale la plus courte (x) entre le bord de ladite ouverture et le bord du sous-support satisfont à la relation (1), et pour au moins une autre ouverture, ladite épaisseur (t) et la distance horizontale la plus courte (x) satisfont à la relation (2).
(JA) 複数の開口部10a,10bのうち、少なくとも1つの開口部における開口端とサブマウント8端の水平方向最短距離xが、サブマウント厚をtとしたときに、式(1)であり、かつ、開口部とは異なるその他の開口部のうち少なくとも1つが、式(2)であるようにしたものである。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)