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Machine translation
1. (WO2014181992) STRIPPER COMPOSITION FOR REMOVING PHOTORESIST AND METHOD FOR STRIPPING PHOTORESIST USING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2014/181992    International Application No.:    PCT/KR2014/003732
Publication Date: 13.11.2014 International Filing Date: 28.04.2014
IPC:
G03F 7/42 (2006.01), H01L 21/306 (2006.01)
Applicants: LG CHEM, LTD. [KR/KR]; 128, Yeoui-daero, Yeongdeungpo-gu Seoul 150-721 (KR)
Inventors: LEE, Woo Ram; (KR).
JUNG, Dae Chul; (KR).
LEE, Dong Hoon; (KR).
PARK, Tae Moon; (KR)
Agent: YOU ME PATENT AND LAW FIRM; 115 Teheran-ro, Gangnam-gu Seoul 135-912 (KR)
Priority Data:
10-2013-0051381 07.05.2013 KR
10-2014-0050060 25.04.2014 KR
Title (EN) STRIPPER COMPOSITION FOR REMOVING PHOTORESIST AND METHOD FOR STRIPPING PHOTORESIST USING SAME
(FR) COMPOSITION DE DECAPANT POUR L'ELIMINATION DE RESINE PHOTOSENSIBLE ET PROCEDE POUR LE DECAPAGE DE RESINE PHOTOSENSIBLE L'UTILISANT
(KO) 포토레지스트 제거용 스트리퍼 조성물 및 이를 사용한 포토레지스트의 박리방법
Abstract: front page image
(EN)The present invention relates to a stripper composition for removing photoresist and a method for stripping photoresist using the same, in which the stripper composition for removing photoresist exhibits excellent performance in removing and stripping photoresist and can effectively inhibit stains on a lower film containing copper and the like from being generated or remaining. The stripper composition for removing photoresist comprises: at least one type of amine compound; a polar organic solvent; an alkylene glycol-based solvent; and a corrosion inhibitor.
(FR)La présente invention concerne une composition de décapant pour l'élimination de résine photosensible et un procédé pour le décapage de résine photosensible l'utilisant, la composition de décapant pour l'élimination de résine photosensible présentant d'excellentes performances pour l'élimination et le décapage de résine photosensible et pouvant empêcher de manière efficace la génération ou la persistance de taches sur un film inférieur contenant du cuivre et analogue. La composition de décapant pour l’élimination de résine photosensible comprend : au moins un type de composé amine ; un solvant organique polaire ; un solvant à base d'alkylèneglycol ; et un inhibiteur de corrosion.
(KO)본 발명은 포토레지스트에 대한 우수한 제거 및 박리 성능을 나타내면서도, 구리 등을 함유한 하부막 상의 얼룩 또는 이물의 발생 또는 잔류를 효과적으로 억제할 수 있는 포토레지스트 제거용 스트리퍼 조성물 및 이를 이용한 포토레지스트의 박리방법에 관한 것이다. 상기 포토레지스트 제거용 스트리퍼 조성물은 1종 이상의 아민 화합물; 극성 유기 용매; 알킬렌글리콜계 용매; 및 부식 방지제를 포함하는 것이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)