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1. (WO2014179419) CHEMICAL MECHANICAL PLANARIZATION SLURRY COMPOSITION COMPRISING COMPOSITE PARTICLES, PROCESS FOR REMOVING MATERIAL USING SAID COMPOSITION, CMP POLISHING PAD AND PROCESS FOR PREPARING SAID COMPOSITION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2014/179419    International Application No.:    PCT/US2014/036093
Publication Date: 06.11.2014 International Filing Date: 30.04.2014
IPC:
C09G 1/02 (2006.01), H01L 21/304 (2006.01)
Applicants: CABOT CORPORATION [US/US]; Two Seaport Lane Suite 1300 Boston, MA 02210 (US)
Inventors: ZHANG, Qingling; (US).
GREENWOOD, Bennett; (US).
SHARMA, Ravi; (US).
MOESER, Geoffrey, D.; (US).
PREVO, Brian, G.; (US).
HAMPDEN-SMITH, Mark, J.; (US)
Agent: ROSEN, Valarie, B.; Cabot Corporation 157 Concord Road Billerica, MA 01821 (US)
Priority Data:
PCT/US2014/031078 18.03.2014 US
61/919,251 20.12.2013 US
61/819,229 03.05.2013 US
61/919,215 20.12.2013 US
Title (EN) CHEMICAL MECHANICAL PLANARIZATION SLURRY COMPOSITION COMPRISING COMPOSITE PARTICLES, PROCESS FOR REMOVING MATERIAL USING SAID COMPOSITION, CMP POLISHING PAD AND PROCESS FOR PREPARING SAID COMPOSITION
(FR) COMPOSITIONS DE SUSPENSION ÉPAISSE POUR LA PLANARISATION CHIMICO-MÉCANIQUE CONTENANT DES PARTICULES COMPOSITES, PROCÉDÉ D'ENLÈVEMENT DE MATIÈRE AU MOYEN DE CETTE COMPOSITION, TAMPON DE POLISSAGE POUR PLANARISATION CHIMICO-MÉCANIQUE ET PROCÉDÉ DE PRÉPARATION DE LADITE COMPOSITION
Abstract: front page image
(EN)CMP processes, tools and slurries utilize composite particles that include core particles having organosilica particles disposed about the core particles. Using these processes, tools and slurries can enhance removal rates, reduce defectivity and increase cleanability with respect to comparable systems and substrates.
(FR)L'invention concerne des procédés, des outils et des suspensions épaisses de planarisation chimico-mécanique (CMP), qui utilisent des particules composites qui comprennent des particules de noyau ayant des particules d'organosilice disposées autour des particules de noyau. L'utilisation de ces procédés, outils et suspensions épaisses peut améliorer les vitesses d'enlèvement, réduire le caractère défectueux et augmente la capacité de nettoyage par rapport à des systèmes et substrats comparables.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)