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1. (WO2014178949) LOCAL INTERCONNECT STRUCTURES FOR HIGH DENSITY
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2014/178949    International Application No.:    PCT/US2014/023657
Publication Date: 06.11.2014 International Filing Date: 11.03.2014
Chapter 2 Demand Filed:    24.09.2014    
IPC:
H01L 21/8234 (2006.01), H01L 21/768 (2006.01), H01L 27/02 (2006.01), H01L 27/088 (2006.01)
Applicants: QUALCOMM INCORPORATED [US/US]; ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 (US)
Inventors: ZHU, John Jianhong; (US).
NALLAPATI, Giridhar; (US).
CHIDAMBARAM, Pr; (US)
Agent: HALLMAN, Jonathan W.; Haynes and Boone, LLP 2323 Victory Avenue, Suite 700 Dallas, Texas 75219 (US)
Priority Data:
13/829,864 14.03.2013 US
Title (EN) LOCAL INTERCONNECT STRUCTURES FOR HIGH DENSITY
(FR) STRUCTURES D'INTERCONNEXION LOCALE POUR HAUTE DENSITÉ
Abstract: front page image
(EN)A local interconnect structure is provided that includes a gate- directed local interconnect (435) coupled to an adjacent gate layer (425) through a diffusion-directed local interconnect (445).
(FR)Cette invention concerne une structure d'interconnexion locale, comprenant une interconnexion locale côté grille (435) couplée à une couche de grille adjacente (425) par l'intermédiaire d'une interconnexion locale côté diffusion (445).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)