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Machine translation
1. (WO2014178639) FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2014/178639    International Application No.:    PCT/KR2014/003831
Publication Date: 06.11.2014 International Filing Date: 30.04.2014
IPC:
H05K 3/28 (2006.01), H05K 1/02 (2006.01)
Applicants: AMOGREENTECH CO., LTD. [KR/KR]; 91, Gimpo-daero 1950beon-gil, Tongjin-eup Gimpo-si, Gyeonggi-do 415-868 (KR)
Inventors: KIM, Jongsoo; (KR).
YU, Jeong-Sang; (KR).
KWON, O-Chung; (KR).
KIM, Jae-Sic; (KR)
Agent: HANYANG PATENT FIRM; (Hanyang building) 12 Nonhyeonro 38-gil, Gangnam-gu Seoul 135-854 (KR)
Priority Data:
10-2013-0048596 30.04.2013 KR
10-2013-0103102 29.08.2013 KR
Title (EN) FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
(FR) CARTE DE CIRCUIT IMPRIMÉ SOUPLE ET SON PROCÉDÉ DE FABRICATION
(KO) 연성인쇄회로기판 및 그 제조 방법
Abstract: front page image
(EN)The present invention relates to a flexible printed circuit board and a method for manufacturing the same, wherein: a circuit pattern is formed on a substrate, and a protective coating layer for covering and protecting the circuit pattern is formed by applying a coating solution to the substrate such that the circuit pattern is firmly attached to the substrate; and operation reliability can be improved by preventing deformation of and damage to the circuit pattern due to repeated bending or warpage of the substrate.
(FR)La présente invention porte sur une carte de circuit imprimé souple et sur son procédé de fabrication. Un motif de circuit est formé sur un substrat, et une couche de revêtement protecteur servant à couvrir et à protéger le motif de circuit est formée par application d'une solution de revêtement sur le substrat de manière que le motif de circuit soit solidement fixé au substrat ; et la fiabilité de fonctionnement peut être améliorée par prévention de déformation et d'endommagement du motif de circuit en raison d'une flexion ou déformation répétée du substrat.
(KO)본 발명은 연성인쇄회로기판 및 그 제조 방법에 관한 것으로, 기재에 회로패턴을 형성하고, 기재에 코팅액을 도포하여 상기 회로패턴을 덮어 보호하는 보호코팅층을 형성함으로써 회로패턴을 기재에 견고하게 부착시키며, 기재의 반복된 굽힘이나 휨 변형에 의한 회로패턴의 변형 및 손상을 방지하여 동작 신뢰성을 향상시킨다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)