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1. (WO2014178252) FILM-LIKE ADHESIVE, DICING TAPE-INTEGRATED FILM-LIKE ADHESIVE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2014/178252    International Application No.:    PCT/JP2014/059494
Publication Date: 06.11.2014 International Filing Date: 31.03.2014
IPC:
H01L 21/52 (2006.01), C09J 9/02 (2006.01), C09J 11/04 (2006.01), C09J 201/00 (2006.01), H01B 1/20 (2006.01), H01B 1/22 (2006.01), H01L 21/301 (2006.01)
Applicants: NITTO DENKO CORPORATION [JP/JP]; 1-1-2,Shimohozumi,Ibaraki-shi, Osaka 5678680 (JP)
Inventors: SUGO, Yuki; (JP)
Agent: UNIUS PATENT ATTORNEYS OFFICE; SHIN-OSAKA MT Bldg. 1, 13-9, Nishinakajima 5-chome, Yodogawa-ku, Osaka-shi, Osaka 5320011 (JP)
Priority Data:
2013-095410 30.04.2013 JP
Title (EN) FILM-LIKE ADHESIVE, DICING TAPE-INTEGRATED FILM-LIKE ADHESIVE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
(FR) ADHÉSIF DE TYPE FILM, ADHÉSIF DE TYPE FILM INTÉGRÉ À UNE BANDE DE DÉCOUPAGE EN DÉS ET PROCÉDÉ DE FABRICATION DE DISPOSITIF À SEMI-CONDUCTEUR
(JA) フィルム状接着剤、ダイシングテープ一体型フィルム状接着剤、及び、半導体装置の製造方法
Abstract: front page image
(EN)A film-like adhesive for semiconductor devices, which contains a thermosetting resin, a curing agent and conductive particles, and which has a glass transition temperature of 130°C or more after being cured.
(FR)L'invention concerne un adhésif de type film pour dispositifs à semi-conducteurs, qui contient une résine thermodurcissable, un agent de durcissement et des particules conductrices, et qui présente une température de transition vitreuse supérieure ou égale à 130°C après durcissement.
(JA) 熱硬化性樹脂と硬化剤と導電性粒子を含み、熱硬化後のガラス転移温度が130℃以上である半導体装置用のフィルム状接着剤。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)