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1. (WO2014177918) COMPACT MOLDED INTERCONNECT DEVICE FOR AUTOMOTIVE APPLICATIONS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2014/177918    International Application No.:    PCT/IB2013/055560
Publication Date: 06.11.2014 International Filing Date: 08.07.2013
IPC:
B60R 25/01 (2013.01)
Applicants: SATYAM-VENTURE ENGINEERING SERVICES PVT LTD [IN/IN]; 1-8-301-306, 3rd floor, Ashoka MyHome chambers S.P. Road Secunderabad 500003 (IN)
Inventors: JHA, Roshan Kumar; (IN).
JAYANTHI, Bala Subramanyam; (IN)
Priority Data:
1924/CHE/2013 30.04.2013 IN
Title (EN) COMPACT MOLDED INTERCONNECT DEVICE FOR AUTOMOTIVE APPLICATIONS
(FR) DISPOSITIF D'INTERCONNEXION MOULÉ COMPACT POUR APPLICATIONS AUTOMOBILES
Abstract: front page image
(EN)A compact molded interconnect device for automotive applications is disclosed. The electronic circuit (108) lays on a molded plastic component (110) of the compact molded interconnect device to activate and deactivate the electronic switching, dynamic sensing, electronic activation and electronic deactivation of the control unit. The electronic circuit lays on the molded plastic component comprising a laser direct structuring based electronic circuit.
(FR)L'invention porte sur un dispositif d'interconnexion moulé compact pour applications automobiles. Un circuit électronique (108) disposé sur un composant en plastique moulé (110) du dispositif d'interconnexion moulé compact permet d'activer et désactiver la commutation électrique, la détection dynamique, l'activation et la désactivation électroniques de l'unité de commande. Le circuit électronique est placé sur le composant en plastique moulé par structuration directe par laser (technologie LDS).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)