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1. WO2014173391 - BASE SUBSTRATE, METAL-CERAMIC SUBSTRATE PRODUCED FROM A BASE SUBSTRATE AND PROCESS FOR PRODUCING A BASE SUBSTRATE

Publication Number WO/2014/173391
Publication Date 30.10.2014
International Application No. PCT/DE2014/100033
International Filing Date 04.02.2014
IPC
B23K 26/00 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
B28D 1/22 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
1Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhere; Machines, devices, tools therefor
22by cutting, e.g. incising
B28D 5/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
5Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
B23K 26/36 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
B23K 26/40 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
40taking account of the properties of the material involved
C04B 37/02 2006.01
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
37Joining burned ceramic articles with other burned ceramic articles or other articles by heating
02with metallic articles
CPC
B23K 2103/172
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
16Composite materials ; , e.g. fibre reinforced
166Multilayered materials
172wherein at least one of the layers is non-metallic
B23K 2103/52
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
50Inorganic material, e.g. metals, not provided for in B23K2103/02B23K2103/26
52Ceramics
B23K 26/0626
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
062by direct control of the laser beam
0626Energy control of the laser beam
B23K 26/364
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
362Laser etching
364for making a groove or trench, e.g. for scribing a break initiation groove
B23K 26/40
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
40taking account of the properties of the material involved
B28D 1/221
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
1Working stone or stone-like materials, e.g. brick, concrete ; or glass; , not provided for elsewhere; Machines, devices, tools therefor
22by cutting, e.g. incising
221by thermic methods
Applicants
  • ROGERS GERMANY GMBH [DE]/[DE]
Inventors
  • KÜFNER, Daniel
Agents
  • GRAF GLÜCK KRITZENBERGER
Priority Data
10 2013 104 055.122.04.2013DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) BASISSUBSTRAT, METALL-KERAMIK-SUBSTRAT HERGESTELLT AUS EINEM BASISSUBSTRAT SOWIE VERFAHREN ZUM HERSTELLEN EINES BASISSUBSTRATES
(EN) BASE SUBSTRATE, METAL-CERAMIC SUBSTRATE PRODUCED FROM A BASE SUBSTRATE AND PROCESS FOR PRODUCING A BASE SUBSTRATE
(FR) SUBSTRAT DE BASE, SUBSTRAT MÉTAL-CÉRAMIQUE PRODUIT À PARTIR D'UN SUBSTRAT DE BASE ET PROCÉDÉ DE PRODUCTION D'UN SUBSTRAT DE BASE
Abstract
(DE)
Die Erfindung betrifft ein Basissubstrat, ein Metall-Keramik-Substrat hergestellt aus einem derartigen Basissubstrat sowie ein Verfahren zur Herstellung eines Basissubstrates umfassend zumindest eine Keramikschicht (2), die an zumindest einer Oberflächenseite (3a, 2 b) mit mindestens einer Metallisierung (3) versehen ist, bei dem die Metallisierung (3) zur Erzeugung vorzugsweise mehrerer einzelner Metall-Keramik-Substrate (2) aus dem Basissubstrat (1) strukturiert ist, und bei dem zum Abtrennen von ungenützten Randbereichen (1a - 1d) des Basissubstrates (1) und/oder zum Vereinzeln des Basissubstrates (1) in mehrere einzelne Metall-Keramik-Substrate (2) mittels einer Laservorrichtung in zumindest einer Oberflächenseite (3.1, 3.2) der Keramikschicht (3) des Basissubstrates (1) mehrere Sollbruchlinien (6a - 6f) eingebracht werden, wobei sich jeweils zwei der Sollbruchlinien (6a - 6f) in jeweils einem Kreuzungsbereich (K1 - K9) schneiden. Besonders vorteilhaft weisen die Sollbruchlinien (6a - 6f) zumindest in den Kreuzungsbereichen (K1 - K9) eine erste Tiefe (T1) und außerhalb der Kreuzungsbereiche (K1 - K9) eine zweite Tiefe (T2) auf, wobei die erste Tiefe (T1) größer als die zweite Tiefe (T2) ist.
(EN)
The invention relates to a base substrate, to a metal-ceramic substrate produced from a base substrate of this type and also to a process for producing a base substrate comprising at least one ceramic layer (2), which is provided on at least one surface side (3a, 2b) with at least one metallization (3), in which the metallization (3) is structured to produce preferably a plurality of individual metal-ceramic substrates (2) from the base substrate (1), and in which a plurality of predetermined breaking lines (6a - 6f) are made in at least one surface side (3.1, 3.2) of the ceramic layer (3) of the base substrate (1) by means of a laser apparatus for severing unused marginal regions (1a -1d) of the base substrate (1) and/or for separating the base substrate (1) into a plurality of individual metal-ceramic substrates (2), in each case two of the predetermined breaking lines (6a - 6f) intersecting in a respective intersection region (K1 - K9). It is particularly advantageous that the predetermined breaking lines (6a - 6f) have a first depth (T1) at least in the intersection regions (K1 - K9) and a second depth (T2) outside the intersection regions (K1 - K9), the first depth (T1) being greater than the second depth (T2).
(FR)
L'invention concerne un substrat de base, un substrat métal-céramique produit à partir dudit substrat de base, ainsi qu'un procédé de production d'un substrat de base comprenant au moins une couche céramique (2) qui est munie d'au moins une métallisation (3) sur au moins un côté (3a, 2b) de sa surface. Selon le procédé, la métallisation (3) est structurée pour produire de préférence plusieurs substrats métal-céramique (2) à partir du substrat de base (1), plusieurs lignes de rupture théoriques (6a-6f) sont pratiquées dans au moins un côté (3.1, 3.2) de la surface de la couche céramique (3) du substrat de base (1) pour séparer les parties périphériques inutilisées (1a-1d) du substrat de base (1) et/ou pour diviser le substrat de base (1) en plusieurs substrats métal-céramique (2) individuels au moyen d'un dispositif laser, et au moins deux des lignes de rupture théorique (6a-6f) se coupent respectivement dans une zone d'intersection (K1-K9) respective. De manière particulièrement avantageuse, les lignes de rupture théoriques (6a-6f) présentent une première profondeur (T1) au moins dans les zones d'intersection (K1-K9) et une seconde profondeur (T2) hors des zones d'intersection (K1-K9), la première profondeur (T1) étant plus grande que la seconde profondeur (T2).
Also published as
Latest bibliographic data on file with the International Bureau