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1. WO2014171621 - SEMICONDUCTOR CHIP TEST SOCKET AND METHOD FOR MANUFACTURING SAME

Publication Number WO/2014/171621
Publication Date 23.10.2014
International Application No. PCT/KR2014/001122
International Filing Date 11.02.2014
IPC
G01R 31/26 2014.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26Testing of individual semiconductor devices
H01L 21/66 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
CPC
G01R 1/0433
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
04Housings; Supporting members; Arrangements of terminals
0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
0433Sockets for IC's or transistors
G01R 1/045
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
04Housings; Supporting members; Arrangements of terminals
0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
0433Sockets for IC's or transistors
0441Details
045Sockets or component fixtures for RF or HF testing
G01R 1/0466
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
04Housings; Supporting members; Arrangements of terminals
0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
0433Sockets for IC's or transistors
0441Details
0466concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
G01R 3/00
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
3Apparatus or processes specially adapted for the manufacture ; or maintenance; of measuring instruments ; , e.g. of probe tips
G01R 31/2884
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2851Testing of integrated circuits [IC]
2884using dedicated test connectors, test elements or test circuits on the IC under test
Applicants
  • 신종천 SHIN, Jong Cheon [KR]/[KR]
  • 하동호 HA, Dong Ho [KR]/[KR]
Inventors
  • 신종천 SHIN, Jong Cheon
  • 하동호 HA, Dong Ho
Agents
  • 김인한 KIM, In Han
Priority Data
10-2013-004165016.04.2013KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) SEMICONDUCTOR CHIP TEST SOCKET AND METHOD FOR MANUFACTURING SAME
(FR) PRISE D'ESSAIS POUR PUCE À SEMI-CONDUCTEURS ET SON PROCÉDÉ DE FABRICATION
(KO) 반도체 칩 테스트용 소켓 및 그 제조 방법
Abstract
(EN)
The present invention relates to a semiconductor chip test socket and a method for manufacturing the same, and the semiconductor chip test socket according to the present invention includes: a film layer; a semiconductor chip test terminal arranged on the film layer so as to be connected to the terminal of a semiconductor chip; and a resilient conductive pad arranged on the film layer so as to be connected to the ground terminal of the semiconductor chip.
(FR)
La présente invention concerne une prise qui sert à tester une puce à semi-conducteurs et son procédé de fabrication. Une prise d'essais pour puce à semi-conducteurs selon la présente invention comprend : une couche de film ; une borne d'essai pour puce à semi-conducteurs placée sur la couche de film de façon à être connectée à la borne de la puce à semi-conducteurs ; et un coussin conducteur élastique placé sur la couche de film de façon à être connecté à la borne de mise à la terre de la puce à semi-conducteurs.
(KO)
본 발명은 반도체 칩 테스트용 소켓 및 그 제조 방법에 관한 것으로, 본 발명에 따른 반도체 칩 테스트용 소켓은, 필름층; 상기 필름층 상에 배치되어 반도체 칩의 단자와 접속되는 반도체 칩 테스트 단자; 상기 필름층 상에 배치되어 상기 반도체 칩의 접지 단자에 접속되는 도전성 탄성 패드;를 포함하여 구성된다.
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