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1. WO2014164417 - METHOD OF FORMING ADHESIVE CONNECTIONS

Publication Number WO/2014/164417
Publication Date 09.10.2014
International Application No. PCT/US2014/022381
International Filing Date 10.03.2014
IPC
E04B 2/88 2006.01
EFIXED CONSTRUCTIONS
04BUILDING
BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
2Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
88Curtain walls
E04B 5/46 2006.01
EFIXED CONSTRUCTIONS
04BUILDING
BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
5Floors; Floor construction with regard to insulation; Connections specially adapted therefor
46Special adaptation of floors for transmission of light, e.g. by inserts of glass
CPC
C03C 27/10
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
27Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
06Joining glass to glass by processes other than fusing
10with the aid of adhesive specially adapted for that purpose
E04B 1/61
EFIXED CONSTRUCTIONS
04BUILDING
BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
1Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
38Connections for building structures in general
61of slab-shaped building elements with each other
E04B 2/721
EFIXED CONSTRUCTIONS
04BUILDING
BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
2Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
72Non-load-bearing; walls of elements of relatively thin form ; with respect to the thickness of the wall
721connections specially adapted therefor
E04B 2/88
EFIXED CONSTRUCTIONS
04BUILDING
BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
2Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
88Curtain walls
E04B 5/023
EFIXED CONSTRUCTIONS
04BUILDING
BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
5Floors; Floor construction with regard to insulation; Connections specially adapted therefor
02Load-carrying floor structures formed substantially of prefabricated units
023Separate connecting devices for prefabricated floor-slabs
E04B 5/46
EFIXED CONSTRUCTIONS
04BUILDING
BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
5Floors; Floor construction with regard to insulation; Connections specially adapted therefor
46Special adaptation of floors for transmission of light, e.g. by inserts of glass
Applicants
  • 3M INNOVATIVE PROPERTIES COMPANY [US]/[US]
Inventors
  • BALLESTEROS, Fernando
  • FERNÁNDEZ, Maríano
  • GARCÍA, Henri
Agents
  • EHRICH, Dena M.
Priority Data
13158668.711.03.2013EP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD OF FORMING ADHESIVE CONNECTIONS
(FR) PROCÉDÉ DE FORMATION DE LIAISONS ADHÉSIVES
Abstract
(EN)
The present disclosure relates to a composite assembly comprising an optically transparent substrate. The present disclosure is also directed to a method of forming an adhesive connection between an optically transparent substrate and a second substrate.
(FR)
La présente invention concerne un ensemble composite comprenant un substrat optiquement transparent. La présente invention concerne également un procédé de formation d'une liaison adhésive entre un substrat optiquement transparent et un second substrat.
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