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1. WO2014160006 - MICROPHONE PACKAGE WITH INTEGRATED SUBSTRATE

Publication Number WO/2014/160006
Publication Date 02.10.2014
International Application No. PCT/US2014/025613
International Filing Date 13.03.2014
IPC
H04R 1/04 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers
02Casings; Cabinets; Mountings therein
04Structural association of microphone with electric circuitry therefor
B81C 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
H04R 19/00 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
H04R 1/28 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers
20Arrangements for obtaining desired frequency or directional characteristics
22for obtaining desired frequency characteristic only
28Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
CPC
B81B 2201/0257
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
02Sensors
0257Microphones or microspeakers
B81C 1/00309
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00261Processes for packaging MEMS devices
00309suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
B81C 2203/0118
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
2203Forming microstructural systems
01Packaging MEMS
0118Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
H04R 1/00
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers, ; loudspeakers or microphones
H04R 1/2846
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers, ; loudspeakers or microphones
20Arrangements for obtaining desired frequency or directional characteristics
22for obtaining desired frequency characteristic only
28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
2807Enclosures comprising vibrating or resonating arrangements
2838of the bandpass type
2846Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
H04R 19/005
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
005using semiconductor materials
Applicants
  • ROBERT BOSCH GMBH [DE]/[DE]
  • SALMON, Jay [US]/[US] (US)
Inventors
  • SALMON, Jay
Agents
  • PRPROCKI, Andrew P.
Priority Data
13/971,38220.08.2013US
61/782,56914.03.2013US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) MICROPHONE PACKAGE WITH INTEGRATED SUBSTRATE
(FR) BOÎTIER DE MICROPHONE AYANT SUBSTRAT INTÉGRÉ
Abstract
(EN)
MEMS microphone packages are described that include an ASIC integrated in the base substrate of the package housing. Methods of manufacturing the same and methods for separating individual microphone packages from wafer form assembly arrays are also described.
(FR)
L'invention porte sur des boîtiers de microphone à MEMS qui comprennent un ASIC intégré dans le substrat de base du logement de boîtier. L'invention porte également sur des procédés de fabrication de ces derniers et sur des procédés pour séparer des boîtiers de microphone individuels à partir de réseaux d'ensemble de formation de tranche de semi-conducteur.
Latest bibliographic data on file with the International Bureau