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1. WO2014157728 - COPPER FOIL WITH CARRIER, PRINTED CIRCUIT BOARD, COPPER CLAD LAMINATED SHEET, ELECTRONIC DEVICE, AND PRINTED CIRCUIT BOARD FABRICATION METHOD

Publication Number WO/2014/157728
Publication Date 02.10.2014
International Application No. PCT/JP2014/059570
International Filing Date 31.03.2014
IPC
B32B 15/01 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
01all layers being exclusively metallic
B32B 15/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
H05K 1/09 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the metallic pattern
CPC
B32B 15/018
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
01all layers being exclusively metallic
018one layer being formed of a noble metal or a noble metal alloy
B32B 15/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
04comprising metal as the main or only constituent of a layer, ; which is; next to another layer of ; the same or of; a ; different material
08of synthetic resin
B32B 15/20
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
20comprising aluminium or copper
B32B 2307/538
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2307Properties of the layers or laminate
50having particular mechanical properties
538Roughness
B32B 2457/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2457Electrical equipment
08PCBs, i.e. printed circuit boards
C25D 1/04
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
1Electroforming
04Wires; Strips; Foils
Applicants
  • JX日鉱日石金属株式会社 JX NIPPON MINING & METALS CORPORATION [JP]/[JP]
Inventors
  • 古曳 倫也 KOHIKI,Michiya
Agents
  • アクシス国際特許業務法人 AXIS PATENT INTERNATIONAL
Priority Data
2013-07518829.03.2013JP
2013-07519829.03.2013JP
2013-07520129.03.2013JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COPPER FOIL WITH CARRIER, PRINTED CIRCUIT BOARD, COPPER CLAD LAMINATED SHEET, ELECTRONIC DEVICE, AND PRINTED CIRCUIT BOARD FABRICATION METHOD
(FR) FEUILLE DE CUIVRE AYANT UN SUPPORT, CARTE DE CIRCUIT IMPRIMÉ, FEUILLE STRATIFIÉE À REVÊTEMENT DE CUIVRE, DISPOSITIF ÉLECTRONIQUE, ET PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ
(JA) キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法
Abstract
(EN)
Provided is a copper foil with a carrier, the ultrathin copper layer of which has good laser-hole-opening properties, and which is suitable for the fabrication of a high-density integrated circuit substrate. The copper foil with a carrier is provided with a carrier, an intermediate layer, and ultrathin copper layer, in that order. When the ultrathin copper layer is peeled off in accordance with JIS C 6471 after the copper foil with a carrier is heated at 200°C for two hours, the surface roughness (Sz) of the ultrathin copper layer on the intermediate layer side is 1.40μm to 4.05μm as measured by a laser microscope.
(FR)
L'invention concerne une feuille de cuivre ayant un support, dont la couche de cuivre ultramince possède de bonnes propriétés d'ouverture de trous par laser, et qui est appropriée pour la fabrication d'un substrat de circuit intégré à haute densité. La feuille de cuivre ayant un support comprend un support, une couche intermédiaire et une couche de cuivre ultramince, dans cet ordre. Lorsque la couche de cuivre ultramince est décollée selon la norme JIS C 6471 après que la feuille de cuivre ayant un support a été chauffée à 200°C pendant deux heures, la rugosité de surface (Sz) de la couche de cuivre ultramince sur le côté couche intermédiaire est de 1,40 µm à 4,05 µm, telle que mesurée par un microscope à laser.
(JA)
 極薄銅層のレーザー穴空け性が良好で、高密度集積回路基板の作製に好適なキャリア付銅箔を提供する。キャリアと、中間層と、極薄銅層とをこの順に備えたキャリア付銅箔であって、キャリア付銅箔を220℃で2時間加熱した後、JIS C 6471に準拠して極薄銅層を剥がしたとき、レーザー顕微鏡で測定される極薄銅層の中間層側の表面粗さSzが1.40μm以上4.05μm以下であるキャリア付銅箔。
Also published as
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