Processing

Please wait...

Settings

Settings

Goto Application

1. WO2014156507 - COMPOSITE SUBSTRATE AND ELASTIC WAVE DEVICE

Publication Number WO/2014/156507
Publication Date 02.10.2014
International Application No. PCT/JP2014/055421
International Filing Date 04.03.2014
IPC
H03H 9/25 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
25Constructional features of resonators using surface acoustic waves
H03H 9/145 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
02Details
125Driving means, e.g. electrodes, coils
145for networks using surface acoustic waves
CPC
H01L 41/0805
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
08Piezo-electric or electrostrictive devices
0805based on piezo-electric or electrostrictive films or coatings
H01L 41/312
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
22Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
31Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base
312by laminating or bonding of piezo-electric or electrostrictive bodies
H03H 9/02574
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
02Details
02535of surface acoustic wave devices
02543Characteristics of substrate, e.g. cutting angles
02574of combined substrates, multilayered substrates, piezo-electrical layers on not-piezo- electrical substrate
H03H 9/02834
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
02Details
02535of surface acoustic wave devices
02818Means for compensation or elimination of undesirable effects
02834of temperature influence
Y10T 428/24942
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
24Structurally defined web or sheet [e.g., overall dimension, etc.]
24942including components having same physical characteristic in differing degree
Applicants
  • 日本碍子株式会社 NGK INSULATORS, LTD. [JP]/[JP]
Inventors
  • 堀 裕二 HORI, Yuji
  • 多井 知義 TAI, Tomoyoshi
Agents
  • 特許業務法人アイテック国際特許事務所 ITEC INTERNATIONAL PATENT FIRM
Priority Data
2013-06631927.03.2013JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COMPOSITE SUBSTRATE AND ELASTIC WAVE DEVICE
(FR) SUBSTRAT COMPOSITE ET DISPOSITIF À ONDES ÉLASTIQUES
(JA) 複合基板及び弾性波デバイス
Abstract
(EN)
A composite substrate (10) is obtained by bonding a piezoelectric substrate (12) and a supporting substrate (14) that has a lower thermal expansion coefficient than the piezoelectric substrate (12). The supporting substrate (14) has a first surface (14a) that is bonded to the piezoelectric substrate (12) and a second surface (14b) that is on the reverse side of the first surface (14a). The thermal expansion coefficient of the supporting substrate (14) in the thickness direction gradually decreases from the second surface (14b) to the middle point (14c) between the first surface (14a) and the second surface (14b) in the thickness direction.
(FR)
L'invention concerne un substrat composite (10) qui est obtenu par collage d'un substrat piézoélectrique (12) et d'un substrat de support (14) qui possède un coefficient d'expansion thermique inférieur à celui du substrat piézoélectrique (12). Le substrat de support (14) possède une première surface (14a) qui est collée au substrat piézoélectrique (12) et une seconde surface (14b) qui est sur le côté inverse à la première surface (14a). Le coefficient d'expansion thermique du substrat de support (14) dans la direction de l'épaisseur diminue de manière graduelle à partir de la seconde surface (14b) vers le point central (14c) entre la première surface (14a) et la seconde surface (14b) dans la direction de l'épaisseur.
(JA)
 複合基板10は、圧電基板12と該圧電基板12よりも熱膨張係数の小さい支持基板14とを接合したものである。支持基板14は、圧電基板12に接合されている第1面14aと該第1面14aとは反対側の第2面14bとを有している。支持基板14の厚さ方向の熱膨張係数は、第2面14bから第1面14aと第2面14bとの中間位置14cまでは厚さ方向に進むにつれて小さくなっている。
Latest bibliographic data on file with the International Bureau