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1. WO2014156017 - SPEAKER AND MANUFACTURING METHOD THEREOF

Publication Number WO/2014/156017
Publication Date 02.10.2014
International Application No. PCT/JP2014/001398
International Filing Date 12.03.2014
IPC
H04R 9/04 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
9Transducers of moving-coil, moving-strip, or moving-wire type
02Details
04Construction, mounting, or centering of coil
H04R 31/00 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
31Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
CPC
H04R 1/06
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers, ; loudspeakers or microphones
06Arranging circuit leads; Relieving strain on circuit leads
H04R 31/00
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
31Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
H04R 31/006
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
31Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
006Interconnection of transducer parts
H04R 7/18
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
7Diaphragms for electromechanical transducers
16Mounting or tensioning of diaphragms or cones
18at the periphery
H04R 9/025
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
9Transducers of moving-coil, moving-strip, or moving-wire type
02Details
025Magnetic circuit
H04R 9/045
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
9Transducers of moving-coil, moving-strip, or moving-wire type
02Details
04Construction, mounting, or centering of coil
045Mounting
Applicants
  • パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP]/[JP]
Inventors
  • 荒 正道 ARA, Masamichi
  • 阿式 健市 AJIKI, Kenichi
  • 山路 俊憲 YAMAJI, Toshinori
  • 石川 恵二 ISHIKAWA, Keiji
Agents
  • 藤井 兼太郎 FUJII, Kentaro
Priority Data
2013-06586227.03.2013JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SPEAKER AND MANUFACTURING METHOD THEREOF
(FR) HAUT-PARLEUR, ET PROCÉDÉ DE FABRICATION DE CELUI-CI
(JA) スピーカと、その製造方法
Abstract
(EN)
This speaker includes a frame, a magnetic circuit, a magnetic gap, a diaphragm, a voice coil, a connector and a lead wire. The connector is disposed on the frame, and includes a terminal. The lead wire connects the terminal and the voice coil, and has a connection unit connected to the terminal. Further, a first holding unit for holding the lead wire is formed on the connector, and the lead wire is pressure-welded and held between the terminal and the first holding unit.
(FR)
Le haut-parleur de l'invention contient un cadre, un circuit magnétique, un entrefer magnétique, une membrane, une bobine acoustique, une partie connecteur et un fil conducteur. La partie connecteur est agencée sur le cadre, et contient une borne. Le fil conducteur est connecté entre la borne et la bobine acoustique, et possède une partie connexion connectée à la borne. Enfin, une première partie support qui supporte le fil conducteur est formée sur la partie connecteur, et le fil conducteur est supporté par soudage par pression entre la borne et la première partie support.
(JA)
 スピーカは、フレーム、磁気回路、磁気ギャップ、振動板、ボイスコイル、コネクタ部、リード線を含んでいる。コネクタ部はフレームに設けられ、端子を含んでいる。リード線は、端子とボイスコイルとの間を接続し、端子へ接続される接続部を有している。そして、コネクタ部にはリード線を保持する第1保持部が形成されており、リード線は、端子と第1保持部との間に圧接されて保持されている。
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