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1. WO2014127953 - OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SAME

Publication Number WO/2014/127953
Publication Date 28.08.2014
International Application No. PCT/EP2014/051250
International Filing Date 22.01.2014
IPC
H01L 25/16 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
H01L 33/62 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 33/64 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
64Heat extraction or cooling elements
H01L 33/48 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
H01L 33/54 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
54having a particular shape
CPC
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48137
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
H01L 2224/49175
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
491Disposition
4912Layout
49175Parallel arrangements
H01L 25/167
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
16the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 ; and H01L51/00; , e.g. forming hybrid circuits
167comprising optoelectronic devices, e.g. LED, photodiodes
H01L 2933/005
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
0033relating to semiconductor body packages
005relating to encapsulations
H01L 2933/0066
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
0033relating to semiconductor body packages
0066relating to arrangements for conducting electric current to or from the semiconductor body
Applicants
  • OSRAM OPTO SEMICONDUCTORS GMBH [DE]/[DE]
Inventors
  • ILLEK, Stefan
  • SABATHIL, Matthias
Agents
  • WILHELM & BECK
Priority Data
10 2013 202 904.722.02.2013DE
Publication Language German (de)
Filing Language German (DE)
Designated States
Title
(DE) OPTOELEKTRONISCHES HALBLEITERBAUTEIL UND VERFAHREN ZU SEINER HERSTELLUNG
(EN) OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SAME
(FR) COMPOSANT SEMI-CONDUCTEUR OPTOÉLECTRONIQUE ET SON PROCÉDÉ DE FABRICATION
Abstract
(DE) Ein optoelektronisches Halbleiterbauteil (500) umfasst einen optoelektronischen Halbleiterchip (600) mit einer ersten Oberfläche (601) und einer zweiten Oberfläche (602), sowie einen eine Schutzdiode (700) aufweisenden Schutzchip mit einer ersten Oberfläche (701) und einer zweiten Oberfläche (702). Dabei sind der Halbleiterchip und der Schutzchip in einen Formkörper eingebettet (800). An der ersten Oberfläche des Halbleiterchips sind ein erster elektrischer Kontakt (610) und ein zweiter elektrischer Kontakt angeordnet (620). An der ersten Oberfläche des Schutzchips sind ein dritter elektrischer Kontakt (710) und ein vierter elektrischer Kontakt (720) angeordnet. Dabei ist der erste elektrische Kontakt elektrisch leitend mit dem dritten elektrischen Kontakt verbunden. Außerdem ist der zweite elektrische Kontakt elektrisch leitend mit dem vierten elektrischen Kontakt verbunden.
(EN) An optoelectronic semiconductor component (500) comprises an optoelectronic semiconductor chip (600) with a first surface (601) and a second surface (602), in addition to a protective chip which has a protective diode (700), a first surface (701) and a second surface (702). The semiconductor chip and the protective chip are embedded in a moulded body (800). A first electrical contact (610) and a second electrical contact (620) are arranged on the first surface of the semiconductor chip. A third electrical contact (710) and a fourth electrical contact (720) are arranged on the first surface of the protective chip. The first electrical contact is electrically connected to the third electrical contact. In addition, the second electrical contact is electrically connected to the fourth electrical contact.
(FR) L'invention concerne un composant semi-conducteur optoélectronique (500) qui comprend une puce semi-conductrice optoélectronique (600) pourvue d'une première surface (601) et d'une deuxième surface (602), ainsi qu'une puce de protection présentant une diode de protection (700) et pourvue d'une première surface (701) et d'une deuxième surface (702). La puce semi-conductrice et la puce de protection sont noyées dans un corps moulé (800). Un premier contact électrique (610) et un deuxième contact électrique (620) sont agencés sur la première surface de la puce semi-conductrice. Un troisième contact électrique (710) et un quatrième contact électrique (720) sont agencés sur la première surface de la puce de protection. Le premier contact électrique est relié de manière électriquement conductrice au troisième contact électrique. Le deuxième contact électrique est relié de manière électriquement conductrice au quatrième contact électrique.
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