Processing

Please wait...

Settings

Settings

Goto Application

1. WO2014127594 - LIGHT-EMITTING DEVICE HAVING LIGHT-EMITTING DIODE

Publication Number WO/2014/127594
Publication Date 28.08.2014
International Application No. PCT/CN2013/076791
International Filing Date 05.06.2013
IPC
H01L 33/64 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
64Heat extraction or cooling elements
H01L 33/48 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
CPC
H05K 1/0207
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0207using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
H05K 2201/066
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
06Thermal details
066Heatsink mounted on the surface of the PCB
H05K 2201/10106
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10007Types of components
10106Light emitting diode [LED]
Applicants
  • 世光国际贸易有限公司 THE LIGHT OF THE WORLD INTERNATIONAL CO., LTD. [CN]/[CN]
Inventors
  • 纪博文 CHI, Po-wen
Agents
  • 上海智信专利代理有限公司 SHANGHAI ZHI XIN PATENT AGENT LTD.
Priority Data
201310053019.819.02.2013CN
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) LIGHT-EMITTING DEVICE HAVING LIGHT-EMITTING DIODE
(FR) DISPOSITIF ÉLECTROLUMINESCENT À DIODE ÉLECTROLUMINESCENTE
(ZH) 具有发光二极管的发光装置
Abstract
(EN) A light-emitting device (100, 100a, and 100b) having a light-emitting diode (11), comprising a light-emitting diode module (1), a circuit board base (2), a light shade (3), and a heat-dissipation component (4). The light-emitting diode module (1) is provided with the light-emitting diode (11). The light-emitting diode module (1) is arranged at one side of the circuit board base (2). One side of the light shade (3) is adjacent to the other side of the circuit board base (2). The heat-dissipation component (4) is adjacent to the other side of the light shade (3). The light-emitting diode module (1) and the circuit board base (2) have arranged therebetween a first tin layer (5a). The circuit board base (2) and the light shade (3) have arranged therebetween either a second tin layer (5b) or a first graphite layer (6a). Also, the light shade (3) and the heat-dissipation component (4) have arranged therebetween a second graphite layer (6b). Waste heat of the light-emitting device (100, 100a, and 100b) is effectively conducted and discharged, thus extending the service life of the light-emitting device (100, 100a, and 100b).
(FR) Dispositif électroluminescent (100, 100a, et 100b) pourvu d'une diode électroluminescente (11), comprenant un module pour diode électroluminescente (1), une carte de circuit imprimé de base (2), un pare-lumière (3), et un composant de dissipation de chaleur (4). Le module pour diode électroluminescente (1) est pourvu de la diode électroluminescente (11). Le module pour diode électroluminescente (1) est disposé sur un côté de la carte de circuit imprimé de base (2). Un côté du pare-lumière (3) est adjacent à l'autre côté de la carte de circuit imprimé de base (2). Le composant de dissipation de chaleur (4) est adjacent à l'autre côté du pare-lumière (3). Une première couche d'étain (5a) est disposée entre le module pour diode électroluminescente (1) et la carte de circuit imprimé de base (2). Soit une seconde couche d'étain (5b), soit une première couche de graphite (6a) est disposée entre la carte de circuit imprimé de base (2) et le pare-lumière (3). De plus, une seconde couche de graphite (6b) est disposée entre le pare-lumière (3) et le composant de dissipation de chaleur (4). La chaleur résiduelle du dispositif électroluminescent (100, 100a, et 100b) est efficacement conduite et évacuée, ce qui prolonge la durée de vie du dispositif électroluminescent (100, 100a, et 100b).
(ZH) 一种具有发光二极管(11)的发光装置(100,100a,100b),包括一发光二极管模块(1)、一电路板基座(2)、一灯杯(3)、及一散热组件(4),发光二极管模块(1)具有一发光二极管(11),电路板基座(2)的一侧设置有发光二极管模块(1),灯杯(3)的一侧邻设于电路板基座(2)的另一侧,散热组件(4)邻设于灯杯(3)的另一侧,其中,发光二极管模块(1)及电路板基座(2)之间设置有一第一锡层(5a),电路板基座(2)及灯杯(3)之间设置有一第二锡层(5b)或一第一石墨层(6a),以及灯杯(3)及散热组件(4)之间设置有一第二石墨层(6b)。该发光装置(100,100a,100b)的废热将有效地被传导排出,使得该发光装置(100,100a,100b)的使用寿命得以延长。
Latest bibliographic data on file with the International Bureau