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1. WO2014119661 - HEATSINK-LESS ELECTRONIC UNIT

Publication Number WO/2014/119661
Publication Date 07.08.2014
International Application No. PCT/JP2014/052091
International Filing Date 30.01.2014
IPC
H05K 1/18 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 3/46 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
CPC
H05K 1/0201
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
H05K 1/0207
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0207using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
H05K 1/0209
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0209External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
H05K 1/181
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
181associated with surface mounted components
H05K 2201/09972
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
09972Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
Applicants
  • 矢崎総業株式会社 YAZAKI CORPORATION [JP]/[JP]
Inventors
  • 鈴木 正志 SUZUKI Masashi
Agents
  • 本多 弘徳 HONDA Hironori
Priority Data
2013-01619630.01.2013JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) HEATSINK-LESS ELECTRONIC UNIT
(FR) UNITÉ ÉLECTRONIQUE SANS DISSIPATEUR THERMIQUE
(JA) ヒートシンクレス電子ユニット
Abstract
(EN) A heatsink-less electronic unit (10) equipped with a microcomputer (11) and multiple semiconductor relays of various types (12H, 12L-14) that are mounted on a metal-core-less electronic substrate (10A), wherein the microcomputer (11) is disposed on the metal-core-less electronic substrate (10A), wiper relays (12H, 12L) are provided at positions farthest away from the position where the microcomputer (11) is disposed, and the wiper relays (12H, 12L) are also disposed away from each other.
(FR) La présente invention concerne une unité électronique (10) sans dissipateur thermique équipée d'un micro-ordinateur (11) et de plusieurs relais semi-conducteurs de divers types (12H, 12L à 14) qui sont montés sur un substrat électronique (10A) sans noyau métallique, le micro-ordinateur (11) étant disposé sur le substrat électronique (10A) sans noyau métallique, des relais d'essuie-glace (12H, 12L) étant situés au niveau des positions les plus éloignées de la position où le micro-ordinateur (11) est disposé et les relais d'essuie-glace (12H, 12L) étant également disposés à distance les uns des autres.
(JA)  金属コアレス電子基板(10A)に実装されるマイコン(11)と複数個の各種半導体リレー(12H、12L~14)とを備えたヒートシンクレス電子ユニット(10)であって、マイコン(11)が金属コアレス電子基板(10A)に配置され、ワイパーリレー(12H、12L)がマイコン(11)の配置位置から最も遠く離間されると共にワイパーリレー(12H、12L)同士も互いに離して配置される。
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