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1. WO2014119304 - DEVICE FOR ASSISTING DETERMINATION OF SUPPORT PIN POSITIONING, AND METHOD FOR ASSISTING DETERMINATION OF SUPPORT PIN POSITIONING

Publication Number WO/2014/119304
Publication Date 07.08.2014
International Application No. PCT/JP2014/000466
International Filing Date 29.01.2014
IPC
H05K 13/04 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components
CPC
G06F 30/00
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
30Computer-aided design [CAD]
G06T 11/60
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
112D [Two Dimensional] image generation
60Editing figures and text; Combining figures or text
H05K 13/0061
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
H05K 13/0069
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
0069Holders for printed circuit boards
H05K 13/08
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
08Monitoring manufacture of assemblages
Y10T 29/49119
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
49Method of mechanical manufacture
49002Electrical device making
49117Conductor or circuit manufacturing
49119Brush
Applicants
  • パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP]/[JP]
Inventors
  • 竹原 裕起 TAKEHARA, Hirokazu
  • 横井 敬明 YOKOI, Takaaki
Agents
  • 橋本 公秀 HASHIMOTO, Kimihide
Priority Data
2013-01507930.01.2013JP
2013-01508030.01.2013JP
2013-01652331.01.2013JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) DEVICE FOR ASSISTING DETERMINATION OF SUPPORT PIN POSITIONING, AND METHOD FOR ASSISTING DETERMINATION OF SUPPORT PIN POSITIONING
(FR) DISPOSITIF POUR AIDER LA DÉTERMINATION DE POSITIONNEMENT DE GOUPILLES DE SUPPORT, ET PROCÉDÉ POUR AIDER LA DÉTERMINATION DE POSITIONNEMENT DE GOUPILLES DE SUPPORT
(JA) 下受けピンの配置決定支援装置および配置決定支援方法
Abstract
(EN)  When determining the positioning of support pin modules (22) that support, from the undersurface side thereof, a substrate (3) in a substrate holding unit, the present invention: displays synthesized images in which the positions of the support pin modules (22) are input on an image of the already mounted surface of the substrate (3); includes, in planar images of the support pin modules (22) in the pin position image, images of the apexes (25) of shafts (24) and images of contact parts (25a) which would make contact with the undersurface of the substrate (3) and support the same from below, and determines whether the support pins would interfere with already mounted components.
(FR) La présente invention concerne un dispositif pour aider la détermination de positionnement de goupilles de support qui, lors de la détermination du positionnement de modules à goupilles de support (22) qui supportent, à partir de son côté inférieur, un substrat (3) dans une unité de retenue de substrat : affiche des images synthétisées dans lesquelles les positions des modules à goupilles de support (22) sont entrées sur une image de la surface déjà montée du substrat (3); comprend, en images planes des modules à goupilles de support (22) dans l'image de position de goupille, des images des sommets (25) de tiges (24) et des images de parties de contact (25a) qui entreraient en contact avec la surface inférieure du substrat (3) et supporteraient ledit substrat à partir du dessous, et détermine si les goupilles de support gêneront les composants déjà montés.
(JA)  基板保持部において基板(3)を下面側から下受けする下受けピンモジュール(22)の配置の決定に際し、既実装面の画像上に下受けピンモジュール(22)の配置位置を入力した合成画像を表示させ、さらにピン配置画像における下受けピンモジュール(22)の平面画像に軸部(24)の頂部(25)の画像と基板(3)の下面に当接して下受けする当接部(25a)の画像とを含ませ、下受けピンと既実装部品との干渉発生の有無を判断する。
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