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1. WO2014117466 - WHITE LED LAMP SECONDARY ENCAPSULATION STRUCTURE CAPABLE OF REDUCING BLUE-LIGHT HAZARDS

Publication Number WO/2014/117466
Publication Date 07.08.2014
International Application No. PCT/CN2013/077219
International Filing Date 14.06.2013
Chapter 2 Demand Filed 26.01.2014
IPC
H01L 33/50 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
H01L 33/48 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
F21V 9/10 2006.1
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
9Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
08for producing coloured light, e.g. monochromatic; for reducing intensity of light
10with provision for variation of the colour or intensity
CPC
F21K 9/64
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
9Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
64using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
F21Y 2115/10
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
2115Light-generating elements of semiconductor light sources
10Light-emitting diodes [LED]
H01L 33/504
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
501characterised by the materials, e.g. binder
502Wavelength conversion materials
504Elements with two or more wavelength conversion materials
H01L 33/507
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
507the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Applicants
  • 邓雅琴 DENG, Yaqin [CN]/[CN] (AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BE, BF, BG, BH, BJ, BN, BR, BW, BY, BZ, CA, CF, CG, CH, CI, CL, CM, CN, CO, CR, CU, CY, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, FR, GA, GB, GD, GE, GH, GM, GN, GQ, GR, GT, GW, HN, HR, HU, ID, IE, IL, IN, IS, IT, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MC, MD, ME, MG, MK, ML, MN, MR, MT, MW, MX, MY, MZ, NA, NE, NG, NI, NL, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SI, SK, SL, SM, SN, ST, SV, SY, SZ, TD, TG, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, ZA, ZM, ZW)
  • 吴政明 WU, Zhengming [CN]/[CN] (US)
Inventors
  • 吴政明 WU, Zhengming
Agents
  • 上海胜康律师事务所 SHANGHAI SYNC LAW FIRM
Priority Data
201310040930.501.02.2013CN
201310040963.X01.02.2013CN
201310057390.122.02.2013CN
201310210862.230.05.2013CN
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) WHITE LED LAMP SECONDARY ENCAPSULATION STRUCTURE CAPABLE OF REDUCING BLUE-LIGHT HAZARDS
(FR) STRUCTURE D'ENCAPSULATION SECONDAIRE À LAMPE À DEL BLANCHE PERMETTANT DE RÉDUIRE LES RISQUES D'UNE LUMIÈRE BLEUE
(ZH) 可降低蓝光危害的白光LED灯二次封装结构
Abstract
(EN) A white LED lamp secondary encapsulation structure capable of reducing blue-light hazards comprises a substrate (3), a blue LED chip (4) fixed on the substrate (3), and a YAG yellow fluorescent powder layer (6) overlaid on the blue LED chip (4). An outer fluorescent lampshade (1) which covers the blue LED chip (4) and the YAG yellow fluorescent powder layer (6) is further fixed on the substrate (3), and YAG yellow fluorescent powder is provided on the outer fluorescent lampshade (1). The secondary encapsulation structure has the advantages that colors of white light emitted by an LED illuminating lamp are uniform, soft, and harmonious; more importantly, influence of heat dissipated by the blue chip on the performance of the fluorescent powder can be effectively reduced, color temperature drift due to the heat of the chip is avoided, and the service life of the fluorescent powder is prolonged; and blue-light radiation dosage is effectively reduced, blue-light radiation is scattered uniformly, and the potential hazards to human and organisms are reduced.
(FR) L'invention concerne une structure d'encapsulation secondaire à lampe à del blanche permettant de réduire les risques d'une lumière bleue, comprenant un substrat (3), une puce de DEL bleue (4) fixée sur le substrat (3) et une couche de poudre fluorescente jaune de grenat d'yttrium et d'aluminium (6) déposée sur la puce de DEL bleue (4). Un abat-jour fluorescent extérieur (1) recouvrant la puce de DEL bleue (4) et la couche de poudre fluorescente jaune de grenat d'yttrium et d'aluminium (6) est en outre fixé sur le substrat (3), et une poudre fluorescente jaune de grenat d'yttrium et d'aluminium est déposée sur l'abat-jour fluorescent extérieur (1). La structure d'encapsulation secondaire présente les avantages que les couleurs d'une lumière blanche émise par une lampe d'éclairage à DEL sont uniformes, douces et harmonieuses ; qui plus est, l'influence de la chaleur dissipée par la puce bleue sur la performance de la poudre fluorescente peut être réduite efficacement, une dérive en température de couleur due à la chaleur de la puce est évitée, et la durée de vie de la poudre fluorescente est prolongée ; la dose de rayonnement de lumière bleue est réduite efficacement, le rayonnement de lumière bleue est diffusé uniformément et les risques potentiels pour les humains et les organismes sont réduits.
(ZH) 一种可降低蓝光危害的白光LED灯二次封装结构,包括基板(3)、固定在基板(3)上的蓝光LED芯片(4)、叠置在蓝光LED芯片(4)上的YAG黄色荧光粉层(6),所述基板(3)上还固定有罩住蓝光LED芯片(4)和YAG黄色荧光粉层(6)的荧光外灯罩(1),所述荧光外灯罩(1)上具有YAG黄色荧光粉。上述二次封装结构不仅使LED照明灯具发出的白光的色彩更加均匀柔和、色彩更加协调;更重要的是能够有效地减少蓝光芯片散发热量对荧光粉性能的影响,避免芯片热量产生的色温漂移,增加荧光粉寿命;有效降低蓝光辐射剂量并且将蓝光辐射均匀分散,减少对人和生物产生的潜在危害。
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