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1. WO2014112121 - THERMAL SWITCH, METHOD FOR PRODUCING SAME, AND DEVICE FOR ADJUSTING HEIGHT OF MOBILE CONTACT

Publication Number WO/2014/112121
Publication Date 24.07.2014
International Application No. PCT/JP2013/051076
International Filing Date 21.01.2013
IPC
H01H 37/54 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
37Thermally-actuated switches
02Details
32Thermally-sensitive members
52actuated due to deflection of bimetallic element
54wherein the bimetallic element is inherently snap acting
CPC
H01H 11/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
11Apparatus or processes specially adapted for manufacture of electric switches
H01H 2011/0075
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
11Apparatus or processes specially adapted for manufacture of electric switches
0075calibrating mechanical switching properties, e.g. "snap or switch moment", by mechanically deforming a part of the switch, e.g. elongating a blade spring by puncturing it with a laser
H01H 2223/008
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
2223Casings
008metallic
H01H 37/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
37Thermally-actuated switches
02Details
04Bases; Housings; Mountings
H01H 37/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
37Thermally-actuated switches
02Details
12Means for adjustment of "on" or "off" operating temperature
H01H 37/20
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
37Thermally-actuated switches
02Details
12Means for adjustment of "on" or "off" operating temperature
20by varying the position of the thermal element in relation to switch base or casing
Applicants
  • 株式会社生方製作所 UBUKATA INDUSTRIES CO., LTD. [JP]/[JP]
Inventors
  • 東方 伊佐男 HIGASHIKATA, Isao
  • 安達 祐司 ADACHI, Yuji
Agents
  • 特許業務法人 サトー国際特許事務所 SATO INTERNATIONAL PATENT FIRM
Priority Data
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) THERMAL SWITCH, METHOD FOR PRODUCING SAME, AND DEVICE FOR ADJUSTING HEIGHT OF MOBILE CONTACT
(FR) THERMOCONTACTEUR, PROCÉDÉ POUR FABRIQUER CELUI-CI, ET DISPOSITIF POUR AJUSTER LA HAUTEUR D'UN CONTACT MOBILE
(JA) 熱応動スイッチおよびその製造方法並びに可動接点の高さ調整装置
Abstract
(EN) The present invention is a thermal switch (1) that, by means of deforming a metal support body (10) of a thermally actuated plate assembly (7) from an initial shape before adhering a lid plate assembly (6) to a housing assembly (5), adjusts in a manner so that the position of a mobile contact point (9) in the housing assembly (5) is in a predetermined height range with respect to the open end of a housing (3), generates contact pressure between the post-assembly open/closed contact points by means of the height adjustment, and then can calibrate the operating temperature by deforming the vicinity of the adhesion point of the thermally actuated plate assembly (7) of the housing (3).
(FR) La présente invention porte sur un thermocontacteur (1) qui, au moyen de la déformation d'un corps de support métallique (10) d'un ensemble de plaque actionnée par la chaleur (7) à partir d'une forme initiale avant adhésion d'un ensemble de plaque de couvercle (6) sur un ensemble de boîtier (5), s'ajuste de telle sorte que la position d'un point de contact mobile (9) dans l'ensemble de boîtier (5) soit dans une plage de hauteur prédéterminée par rapport à l'extrémité ouverte d'un boîtier (3), génère une pression de contact entre les points de contact ouverts/fermés post-ensemble au moyen de l'ajustement de hauteur, et ensuite peut étalonner la température de fonctionnement par déformation du voisinage du point d'adhésion de l'ensemble de plaque actionnée par la chaleur (7) du boîtier (3).
(JA)  本発明は、ハウジングアセンブリ(5)に蓋板アセンブリ(6)を固着する前に、熱応動板アセンブリ(7)の金属支持体(10)を初期形状から変形することにより、ハウジングアセンブリ(5)における可動接点(9)の位置が、ハウジング(3)の開口端に対し所定の高さ範囲内となるように調整し、この高さ調整により、組立後の開閉接点間に接触圧を生じさせ、その後、ハウジング(3)の熱応動板アセンブリ(7)の固着部近傍を変形して動作温度を較正可能とした熱応動スイッチ(1)である。
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