Processing

Please wait...

Settings

Settings

Goto Application

1. WO2014109018 - WORKPIECE ADHESIVE CHUCK DEVICE AND WORKPIECE ATTACHMENT MACHINE

Publication Number WO/2014/109018
Publication Date 17.07.2014
International Application No. PCT/JP2013/050215
International Filing Date 09.01.2013
Chapter 2 Demand Filed 25.06.2013
IPC
H01L 21/683 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
CPC
H01L 21/67092
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67092Apparatus for mechanical treatment
H01L 21/67132
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67132Apparatus for placing on an insulating substrate, e.g. tape
H01L 21/6838
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6838with gripping and holding devices using a vacuum; Bernoulli devices
Applicants
  • 信越エンジニアリング株式会社 SHIN-ETSU ENGINEERING CO., LTD. [JP]/[JP]
Inventors
  • 大谷 義和 OHTANI Yoshikazu
Agents
  • 特許業務法人 英知国際特許事務所 EICHI PATENT & TRADEMARK CORP.
Priority Data
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) WORKPIECE ADHESIVE CHUCK DEVICE AND WORKPIECE ATTACHMENT MACHINE
(FR) DISPOSITIF DE MANDRIN D'ADHÉSIF DE PIÈCE DE TRAVAIL ET MACHINE DE FIXATION DE PIÈCE DE TRAVAIL
(JA) ワーク粘着チャック装置及びワーク貼り合わせ機
Abstract
(EN) The purpose of the present invention is to easily and surely separate a plate-like workpiece that has been subjected to adhesive separation in vacuum, from a separation part in atmosphere ambient air. Separation parts (2) are elastically deformed in vacuum ambient air to protrude toward a plate-like workpiece (W) held by adhesion by an adhesion part (1), so that pressing surfaces (2a) are brought into contact with a surface (W1) of the plate-like workpiece (W), whereby the plate-like workpiece (W) is separated from the adhesion part (1). Thereafter, while the pressing surfaces (2a) of the separation parts (2) remain in contact with the surface (W1) of the plate-like workpiece (W), peripheries of the plate-like workpiece (W) are made open to atmosphere, whereby air flows through flow paths (2p) from an outer space (S2) to an inner space (S1) of the separation parts (2). Consequently, vacuum break occurs between the inner space (S1) of the separation parts (2) and the plate-like workpiece (W).
(FR) Le but de la présente invention est de séparer facilement et sûrement une pièce de travail de type plaque qui a été soumise à une séparation d'adhésif sous vide, en provenance d'une partie de séparation dans l'air ambiant d'atmosphère. Des parties de séparation (2) sont déformées de manière élastique dans un air ambiant sous vide pour faire saillie vers une pièce de travail de type plaque (W) maintenue par adhésion par une partie d'adhésion (1), de telle sorte que des surfaces de pressage (2a) soient amenées en contact avec une surface (W1) de la pièce de travail de type plaque (W), par lesquelles la pièce de travail de type plaque (W) est séparée de la partie d'adhésion (1). Par la suite, pendant que les surfaces de pressage (2a) des parties de séparation (2) restent en contact avec la surface (W1) de la pièce de travail de type plaque (W), des périphéries de la pièce de travail de type plaque (W) sont rendues ouvertes à l'atmosphère, par lesquelles un air circule à travers des chemins de flux (2p) depuis un espace externe (S2) vers un espace interne (S1) des parties de séparation (2). Par conséquent, un cassage du vide se produit entre l'espace interne (S1) des parties de séparation (2) et la pièce de travail de type plaque (W).
(JA)  真空中で粘着剥離された板状ワークを大気雰囲気で剥離部から容易且つ確実に剥離する。 粘着部1にて粘着保持された板状ワークWに対し、真空雰囲気で剥離部2を弾性的に突出変形して、押圧面2aを板状ワークWの表面W1と接触させることにより、粘着部1から板状ワークWが剥離される。その後、剥離部2の押圧面2aを板状ワークWの表面W1と接触させたままで、板状ワークWの周囲が大気開放されることにより、流路2pを通って剥離部2の外側空間S2から内側空間S1へ空気が流入し、剥離部2の内側空間S1と板状ワークWとの間が真空破壊される。
Related patent documents
Latest bibliographic data on file with the International Bureau