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1. WO2014104913 - MODULE WITH LIGHT-EMITTING DIODES

Publication Number WO/2014/104913
Publication Date 03.07.2014
International Application No. PCT/RU2012/001127
International Filing Date 27.12.2012
IPC
H01L 25/075 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/78
H01L 33/54 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
54having a particular shape
G02B 19/00 2006.1
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
19Condensers
H01L 33/50 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
CPC
G02B 19/0066
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
19Condensers, ; e.g. light collectors or similar non-imaging optics
0033characterised by the use
0047for use with a light source
0061the light source comprising a LED
0066in the form of an LED array
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 33/508
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
508having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
H01L 33/54
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
54having a particular shape
Applicants
  • OPTOGAN NEW TECHNOLOGIES OF LIGHT LLC [RU]/[RU]
Inventors
  • BOUGROV, Vladislav Evgenyevich
  • KOVSH,, Alexey Ruslanovich
  • MYNBAEV, Karim Dzhafarovich
  • ODNOBLYUDOV, Maxim Anatolyevich
  • RAMCHEN, Johann
  • ROMANOV, Alexey Evgenyevich
  • KRAMNIK, Valery Vladimirovich
  • LIPNITSKAYA, Svetlana Nikolaevna
  • NIKULINA, Lidia Andreevna
Agents
  • POLIKARPOV, Alexander Viktorovich
Priority Data
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) MODULE WITH LIGHT-EMITTING DIODES
(FR) MODULE À DIODES ÉLECTROLUMINESCENTES
Abstract
(EN) A light emitting module (10) comprises a substrate plate (1); a plurality of light emitting semiconductor chips (2) placed on the substrate plate; and a continuous encapsulation (5) on the substrate plate encapsulating the light emitting semiconductor chips, the encapsulation comprising a convex lens portion (7) above each semiconductor chip. According to the present invention, in a cross-section of the encapsulation along a plane passing the middle points of two adjacent semiconductor chips, the surface of the convex lens portion has a curvature of radius Rlens meeting the condition W ≤ Rlens ≤ 2W, wherein W is the width of the semiconductor chips, and the convex lens portions of the adjacent semiconductor chips are connected via a concave combining portion (8), the surface of which has a curvature of radius Rcomb ≤ Rlens.
(FR) L'invention concerne un module électroluminescent (10) comportant une plaque (1) de substrat; une pluralité de puces électroluminescentes (2) à semi-conducteur placées sur la plaque de substrat; et un enrobage continu (5) sur la plaque de substrat enrobant les puces électroluminescentes à semi-conducteur, l'enrobage comportant une partie (7) de lentille convexe au-dessus de chaque puce à semi-conducteur. Selon la présente invention, dans une coupe de l'enrobage suivant un plan passant par les milieux de deux puces à semi-conducteur adjacentes, la surface de la partie de lentille convexe présente une courbure de rayon Rlentille satisfaisant la condition W ≤ Rlentille ≤ 2W, où W est la largeur des puces à semi-conducteur, et les parties de lentille convexe des puces à semi-conducteur adjacentes sont reliées par l'intermédiaire d'une partie concave (8) de combinaison, dont la surface présente une courbure de rayon Rcomb ≤ Rlentille.
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