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1. WO2014103300 - END-EFFECTOR DEVICE

Publication Number WO/2014/103300
Publication Date 03.07.2014
International Application No. PCT/JP2013/007582
International Filing Date 25.12.2013
IPC
H01L 21/677 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
CPC
B25J 11/0095
BPERFORMING OPERATIONS; TRANSPORTING
25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
11Manipulators not otherwise provided for
0095Manipulators transporting wafers
H01L 21/67742
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67739into and out of processing chamber
67742Mechanical parts of transfer devices
H01L 21/67766
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
67766Mechanical parts of transfer devices
H01L 21/67769
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
67769Storage means
H01L 21/67781
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
67778involving loading and unloading of waers
67781Batch transfer of wafers
H01L 21/68707
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68707the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Applicants
  • 川崎重工業株式会社 KAWASAKI JUKOGYO KABUSHIKI KAISHA [JP]/[JP]
Inventors
  • 橋本 康彦 HASHIMOTO, Yasuhiko
  • 福島 崇行 FUKUSHIMA, Takayuki
  • 金丸 亮介 KANAMARU, Ryosuke
  • 宮川 大輝 MIYAGAWA, Daiki
Agents
  • 名塚 聡 NAZUKA, Satoshi
Priority Data
2012-28579027.12.2012JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) END-EFFECTOR DEVICE
(FR) DISPOSITIF EFFECTEUR TERMINAL
(JA) エンドエフェクタ装置
Abstract
(EN)
This end-effector device (1) is equipped with: a hand (3) which has housing spaces; and multiple holding sections (4A, 4B) which are provided on the hand (3) and respectively hold the peripheries of respective plate-like members. Each of the holding members (4A, 4B) includes: multiple receiving sections (42) which respectively receive the multiple plate-like members such that there is a vertical pitch between the multiple plate-like members; and a pitch change mechanism (7) which moves each of the multiple receiving sections (42) in the vertical direction so as to change the interval therebetween. Multiple linearly moving sections (41A), which respectively move linearly and integrally with the multiple receiving sections (42), are provided on the hand (3) so as to be exposed to the outside of the hand (3), and multiple driving sections for driving the multiple linearly moving sections (41A) of the pitch change mechanism (7) are housed inside the housing spaces of the hand (3).
(FR)
L'invention se rapporte à un dispositif effecteur terminal (1) qui comprend : une main (3) possédant des espaces de logement ; et plusieurs sections de maintien (4A, 4B) situées sur la main (3) et maintenant respectivement les périphéries d'éléments du type plaque respectifs. Chacun des éléments de maintien (4A, 4B) comporte : plusieurs sections de réception (42) qui reçoivent respectivement les différents éléments du type plaque de manière à ce qu'il y ait un pas vertical entre ces différents éléments du type plaque ; ainsi qu'un mécanisme (7) de changement de pas qui déplace chacune des différentes sections de réception (42) dans la direction verticale de façon à changer l'intervalle entre elles. Plusieurs sections à déplacement linéaire (41A), qui se déplacent respectivement de manière linéaire en formant un seul bloc avec les différentes sections de réception (42), se trouvent sur la main (3) afin d'être visibles à l'extérieur de cette main (3), et plusieurs sections d'entraînement conçues pour entraîner les différentes sections à déplacement linéaire (41A) du mécanisme (7) de changement de pas sont présentes à l'intérieur des espaces de logement de ladite main (3).
(JA)
エンドエフェクタ装置(1)は、収納空間を有するハンド(3)とハンド(3)に設けられ、各板状部材の周縁部を夫々保持する複数の保持部(4A,4B)とを備えている。各保持部(4A,4B)は、複数の板状部材が上下ピッチが開くように該複数の板状部材を夫々受ける複数の受け部(42)と、この複数の受け部(42)を夫々昇降させて間隔を変換するピッチ変換機構(7)を含む。複数の受け部(42)と一体に夫々直線移動する複数の直線移動部(41A)がハンド(3)の外部に露出するように該ハンド(3)に設けられ、ピッチ変換機構(7)の複数の直線移動部(41A)を夫々駆動する複数の駆動部がハンド(3)の収納空間に収納されている。
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