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1. WO2014101446 - LAND GRID ARRAY MODULE AND DEVICE

Publication Number WO/2014/101446
Publication Date 03.07.2014
International Application No. PCT/CN2013/082217
International Filing Date 23.08.2013
IPC
H01Q 1/22 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
1Details of, or arrangements associated with, antennas
12Supports; Mounting means
22by structural association with other equipment or articles
CPC
H01Q 1/2283
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
1Details of, or arrangements associated with, antennas
12Supports; Mounting means
22by structural association with other equipment or articles
2283mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
H01Q 1/38
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
1Details of, or arrangements associated with, antennas
36Structural form of radiating elements, e.g. cone, spiral, umbrella; ; Particular materials used therewith
38formed by a conductive layer on an insulating support
H05K 1/0393
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0393Flexible materials
H05K 1/165
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
16incorporating printed electric components, e.g. printed resistor, capacitor, inductor
165incorporating printed inductors
H05K 2201/053
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
05Flexible printed circuits [FPCs]
053Tails
H05K 2201/10098
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10007Types of components
10098Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
Applicants
  • 中兴通讯股份有限公司 ZTE CORPORATION [CN]/[CN]
Inventors
  • 何祥宇 HE, Xiangyu
  • 孙维菊 SUN, Weiju
  • 马海蓉 MA, Hairong
Agents
  • 北京康信知识产权代理有限责任公司 KANGXIN PARTNERS, P.C.
Priority Data
201210583439.228.12.2012CN
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) LAND GRID ARRAY MODULE AND DEVICE
(FR) MODULE ET DISPOSITIF DE BOÎTIER À MATRICE DE PLOTS
(ZH) 一种栅格阵列封装模块及设备
Abstract
(EN) To solve the problem that the connection between a module body and an antenna in an existing land grid array module is unstable, provided are a land grid array module and device. The land grid array module comprises a module body and an antenna, the module body and the antenna being of an integrated structure. By means of the implementation of the present invention, the module body and the antenna of the land grid array module are integrated, thereby enhancing the strength of connection between the module body and the antenna. In the process of use, the phenomenon of separation of the module body from the antenna will not occur, thereby guaranteeing the operation stability of the device.
(FR) Cette invention vise à résoudre le problème d'instabilité de la connexion entre un corps de module et une antenne dans un module et un dispositif existants de boîtier à matrice de plots (LGA). Ledit module de boîtier à matrice de plots comprend un corps de module et une antenne, le corps de module et l'antenne formant une structure intégrale. La mise en œuvre de l'invention permet d'intégrer le corps de module et l'antenne du module de boîtier à matrice de plots, de sorte à améliorer la connexion entre le corps de module et l'antenne. Lors de l'utilisation, il ne peut pas se produire de séparation du corps de module et de l'antenne, ce qui garantit la stabilité opérationnelle du dispositif.
(ZH) 为了解决当前栅格阵列封装模块中模块主体与天线连接不稳定的问题,本发明提供了一种栅格阵列封装模块及设备。该栅格阵列封装模块包括模块主体和天线,模块主体和天线为一体结构。通过本发明的实施,将栅格阵列封装模块中的模块主体与天线一体化,增强了模块主体与天线的连接强度,在使用过程中不会出现模块主体与天线分离的现象,保证了设备的运行稳定性。
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