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1. WO2014033961 - COMPONENT MOUNTING MACHINE

Publication Number WO/2014/033961
Publication Date 06.03.2014
International Application No. PCT/JP2012/072386
International Filing Date 03.09.2012
IPC
H05K 13/04 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components
H05K 13/08 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
08Monitoring manufacture of assemblages
CPC
H01L 21/67144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
H01L 21/681
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
68for positioning, orientation or alignment
681using optical controlling means
H01L 2224/7565
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
75Apparatus for connecting with bump connectors or layer connectors
7565Means for transporting the components to be connected
H01L 2224/759
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
75Apparatus for connecting with bump connectors or layer connectors
759Means for monitoring the connection process
H01L 24/75
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
75Apparatus for connecting with bump connectors or layer connectors
Applicants
  • 富士機械製造株式会社 FUJI MACHINE MFG. CO., LTD. [JP]/[JP] (AllExceptUS)
  • 岩瀬 友則 IWASE Tomonori [JP]/[JP] (UsOnly)
Inventors
  • 岩瀬 友則 IWASE Tomonori
Agents
  • 小林 脩 KOBAYASHI Osamu
Priority Data
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) COMPONENT MOUNTING MACHINE
(FR) MACHINE DE MONTAGE DE COMPOSANTS
(JA) 部品実装装置
Abstract
(EN) In this component mounting machine (10), the center position of four pick-up nozzles (41) is measured with jigs (45), so the offset between the center position of the four pick-up nozzles (41) and the center position of four pin members (93) can be determined precisely. In particular, the nozzle tips of the pick-up nozzles (41) descend following the contour of the concave portions (45a) of the jigs (45), so the nozzle centers and the jig centers can be made to match precisely. In addition, pick up operation starts when the nozzle tips of the pick-up nozzles (41) reach the bottoms (45b) of the concave portions (45a) of the jigs (45), so the jig centers after the pick-up nozzles (41) are separated from the jigs (45) will match the nozzle centers. As a result, the nozzle offset between the center position of the four pick-up nozzles (41) and the center position of a substrate recognition camera (39) can be calculated precisely from an acquired image of the jigs (45). Therefore, components (P) cut from a wafer can be picked up precisely with the pick-up nozzles (41), and the precision of mounting the components (P) cut from the wafer on a substrate (B) can be improved.
(FR) Dans la machine de montage de composants (10) selon l'invention, la position centrale de quatre embouts de prise (41) est mesurée au moyen de gabarits (45) de sorte que le décalage entre la position centrale des quatre embouts de prise (41) et la position centrale de quatre organes de broches (93) peut être déterminé précisément. En particulier, les pointes d'embout des embouts de prise (41) descendent en suivant le contour des parties concaves (45a) des gabarits (45), de sorte que les centres des embouts et les centres des gabarits peuvent être appariés précisément. De plus, l'opération de prise commence quand les pointes d'embout des embouts de prise (41) atteignent les fonds (45b) des parties concaves (45a) des gabarits (45), de sorte que les centres des gabarits après que les embouts de prise (41) sont séparés des gabarits (45) seront appariés aux centres des embouts. Par conséquent, le décalage des embouts entre la position centrale des quatre embouts de prise (41) et la position centrale d'une caméra de reconnaissance de substrat (39) peut être calculé précisément à partir d'une image acquise des gabarits (45). Des composants (P) découpés dans une plaquette peuvent donc être saisis avec précision au moyen des embouts de prise (41) et la précision de montage des composants (P) découpés dans la plaquette sur un substrat (B) peut être améliorée.
(JA)  部品実装装置10は、4本の吸着ノズル41の中心位置を治具45により測定しているので、4本の吸着ノズル41の中心位置と4本のピン部材93の中心位置とのずれ量を高精度に求めることができる。特に、吸着ノズル41のノズル先端が治具45の凹部45aに倣って下降するので、ノズル中心を治具中心に高精度に一致させることができる。そして、吸着ノズル41のノズル先端が治具45の凹部45aの底部45bに達したときに吸着を開始するので、吸着ノズル41を治具45から離間させた後の治具中心はノズル中心と一致することになる。よって、取得した治具45の画像から4本の吸着ノズル41の中心位置と基板認識用カメラ39の中心位置とのノズルずれ量を高精度に求めることができる。これにより、吸着ノズル41でウエハカット部品Pを高精度に吸着することができ、基板B上へのウエハカット部品Pの装着精度を高めることができる。
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