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1. (WO2013163416) COEFFICIENT OF THERMAL EXPANSION COMPENSATING COMPLIANT COMPONENT
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/163416 International Application No.: PCT/US2013/038200
Publication Date: 31.10.2013 International Filing Date: 25.04.2013
Chapter 2 Demand Filed: 18.11.2013
IPC:
H01L 23/34 (2006.01) ,H05K 7/20 (2006.01)
Applicants: KEMET ELECTRONICS CORPORATION[US/US]; 2835 Kemet Way Simpsonville, SC 29681, US
Inventors: MCCONNELL, John, E.; US
WEBSTER, Alan, P.; US
BULTITUDE, John; US
GURAV, Abhijit; US
Agent: GUY, Joseph, T.; Perkins Law Firm, LLC 200 N. Main Street, Suite 301 Greenville, SC 29601, US
Priority Data:
61/639,42727.04.2012US
61/655,27604.06.2012US
Title (EN) COEFFICIENT OF THERMAL EXPANSION COMPENSATING COMPLIANT COMPONENT
(FR) COMPOSANT CONFORME COMPENSANT LE COEFFICIENT D'EXPANSION THERMIQUE
Abstract: front page image
(EN) An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.
(FR) L'invention concerne un dispositif électronique discret amélioré et un procédé de fabrication du dispositif électronique discret amélioré. Le dispositif électronique discret amélioré a un composant passif électronique avec une terminaison et une grille de connexion. Un composant conforme compensateur se trouve entre la terminaison et la grille de connexion. Le composant conforme compensateur a un noyau composite et un premier conducteur sur le noyau composite. Le premier conducteur est en contact électrique avec la terminaison. Un second conducteur se trouve aussi sur le noyau composite, le second conducteur étant en contact électrique avec la grille de connexion.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)