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1. (WO2013163408) A FLEX CIRCUIT HAVING A MULTIPLE LAYERED STRUCTURE AND INTERCONNECT

Pub. No.:    WO/2013/163408    International Application No.:    PCT/US2013/038187
Publication Date: Fri Nov 01 00:59:59 CET 2013 International Filing Date: Fri Apr 26 01:59:59 CEST 2013
IPC: G11B 5/48
Applicants: SEAGATE TECHNOLOGY LLC
Inventors: SHIVARAMA, Ravishankar, A.
VER MEER, Bradley, J.
ZAMBRI, Razman
Title: A FLEX CIRCUIT HAVING A MULTIPLE LAYERED STRUCTURE AND INTERCONNECT
Abstract:
A flex circuit (140) including a multiple layer structure is disclosed. The multiple layered structure includes a first or base layer (180) and a second top layer (182). Top traces and bond pads (214) are fabricated on the top or obverse layer (182) and interlayer traces and bond pads (216) are fabricated between the first and second layers (180, 182) to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer (180) and the second or top layer (182) and one or more reduced thickness portion including the first or base layer (180) and not the second layer (182). In one embodiment, the gimbal portion of the flex circuit includes the first layer or base layer (180) and not the second layer (182) of the multiple layer structure and in another embodiment a bending portion of the flex circuit includes the first base layer (180) and not the second layer (180, 182) of the multiple layered structure to provide a reduced thickness to facilitate bending, for example in a micro-actuation region of the load beam.